Abstract: A method of managing power states of memory modules while performing memory access operations is disclosed. Memory modules are in a power saving state until an access operation involving the module is to be performed. The module is placed in an operational mode, then the access operation is performed, then the module is returned to the power saving state. Apparatus and systems using the method are also disclosed and claimed.

Abstract: A method of managing power states of memory modules while performing memory access operations is disclosed. Memory modules are in a power saving state until an access operation involving the module is to be performed. The module is placed in an operational mode, then the access operation is performed, then the module is returned to the power saving state. Apparatus and systems using the method are also disclosed and claimed.

Abstract: A method of managing power states of memory modules while performing memory access operations is disclosed. Memory modules are in a power saving state until an access operation involving the module is to be performed. The module is placed in an operational mode, then the access operation is performed, then the module is returned to the power saving state. Apparatus and systems using the method are also disclosed and claimed.

Abstract: A method of managing power states of memory modules while performing memory access operations is discussed. Memory modules are in a power saving state until an access operation involving the module is to be performed. The module is placed in an operational mode, then the access operation is performed, then the module is returned to the power saving state.

Abstract: A method for forming a high density interconnect printed wiring board substrate that has a first patterned conductive layer formed over an upper surface of the substrate that includes multiple conductive lines having edges that define the boundaries of the conductive lines and a dielectric layer formed over the patterned conductive layer and between the edges of the conductive lines. The method includes forming a thin film conductive layer over the dielectric layer, and patterning the thin film conductive layer such that, after the patterning step, the thin film conductive layer overlies each of the edges of the conductive lines. In a preferred embodiment, the thin film conductive layer is patterned such that, after the patterning step, the layer overlies the edges of the conductive lines by at least 10 microns. In another aspect of the invention, a method for strengthening thin film build-up layers deposited over a high density interconnect common circuit base is taught.

Abstract: A high density electrical interconnection device provides a uniform complementary pattern of thieving lines on both X and Y interconnect layers of the high density device to provide for uniform plating of the copper conductors, as well as reducing both nonuniformity and the amount of contraction and expansion of the insulating substrate. The complementary line pattern of thieving lines is generated by computer-aided design techniques and also includes provisions for gaps in thieving lines in one layer so as to eliminate crossover coupling with another layer and provides for visual identification of the thieving lines by the use of an undulating pattern.