Patents by Inventor Scott Matzke

Scott Matzke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ASSEMBLIES AND METHODS FOR SLIDER ELECTRICAL CONNECTION CONTAINING THROUGH CIRCUIT ELECTRICAL CONNECTIONS
    Publication number: 20150332716
    Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.
    Type: Application
    Filed: May 14, 2014
    Publication date: November 19, 2015
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Jason B. Gadbois, Bradley Ver Meer, Joseph Stephan, Scott Matzke, Ravishankar Ajjanagadde Shivarama, Christopher Unger
  • Assemblies and methods for slider electrical connection containing through circuit electrical connections
    Patent number: 9171561
    Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: October 27, 2015
    Assignee: Seagate Technology LLC
    Inventors: Jason B. Gadbois, Bradley Ver Meer, Joseph Stephan, Scott Matzke, Ravishankar Ajjanagadde Shivarama, Christopher Unger
  • Method of forming electrical connections from solder posts
    Patent number: 8947830
    Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: February 3, 2015
    Assignee: Seagate Technology LLC
    Inventors: Aaron Michael Collins, Scott Matzke, Christopher Unger, Paul Davidson, Daniel Richard Buettner