Abstract: This invention relates to specific, improved spun-bonded nonwoven fabrics comprised of continuous multi-component longitudinally splittable fibers. The resulting nonwoven fabrics exhibit enhanced flexibility, drape, softness, thickness, moisture absorption capacity, moisture vapor transmission rate, and cleanliness in comparison with other nonwovens of the same fiber construction. These improved aesthetic and performance characteristics permit expansion of high-strength nonwoven fabric materials into other markets and industries currently dominated by woven and knit fabrics that exhibit such properties themselves, but at high cost and requiring greater manufacturing complexity. Such enhanced fabrics are subjected to certain air impingement procedures, for instance through directing low-pressure gaseous fluids at high velocity to the surface of the targeted nonwoven fabric. Also encompassed within this invention is the method of treating such a specific nonwoven fabric with this air impingement procedure.

Abstract: This invention relates to specific, improved spun-bonded nonwoven fabrics comprised of continuous multi-component longitudinally splittable fibers. The resulting nonwoven fabrics exhibit enhanced flexibility, drape, softness, thickness, moisture absorption capacity, moisture vapor transmission rate, and cleanliness in comparison with other nonwovens of the same fiber construction. These improved aesthetic and performance characteristics permit expansion of high-strength nonwoven fabric materials into other markets and industries currently dominated by woven and knit fabrics that exhibit such properties themselves, but at high cost and requiring greater manufacturing complexity. Such enhanced fabrics are subjected to certain air impingement procedures, for instance through directing low-pressure gaseous fluids at high velocity to the surface of the targeted nonwoven fabric. Also encompassed within this invention is the method of treating such a specific nonwoven fabric with this air impingement procedure.

Abstract: In a preferred embodiment, the present process involves subjecting a fabric having splittable conjugate yarns both to an acidic treatment and to a basic treatment, each of which erodes a portion of the components of the conjugate yarns. The acid treatment, given certain reaction kinetics, removes a portion of the polyamide element of the conjugate filament. The basic treatment has a similar effect on the polyester element of the conjugate filament, making it more hydrophilic. The at least partial removal of the polyamide component, coupled with the increased hydrophilicity of the polyester component, results in a fabric having enhanced absorptive properties. In an alternate embodiment, treatments with only acid or only basic solution may be employed.

Abstract: In a preferred embodiment, the present process involves subjecting the nonwoven fabric both to an acidic treatment and to a caustic treatment, each of which erodes a portion of the components of the conjugate yarns. The acid treatment, given certain reaction kinetics, removes a portion of the polyamide element of the conjugate filament. The caustic treatment has a similar effect on the polyester element of the conjugate filament, making it more hydrophilic. The at least partial removal of the polyamide component, coupled with the increased hydrophilicity of the polyester component, results in a fabric having enhanced absorptive properties. In an alternate embodiment, treatments with only acid or only caustic solution may be employed.

Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.

Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.