Patents by Inventor Scott P. Doran

Scott P. Doran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coplanar packaging techniques for multichip circuits
    Patent number: 5032543
    Abstract: A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.
    Type: Grant
    Filed: June 17, 1988
    Date of Patent: July 16, 1991
    Assignee: Massachusetts Institute of Technology
    Inventors: Jerry G. Black, David K. Astolfi, Scott P. Doran, Daniel J. Ehrlich