Abstract: A method and apparatus which replaces the silicone molds heretofore utilized for protecting the integrity of the cavities formed during the lamination lay-up stage of a low temperature cofired ceramic substrate fabrication. Now a single sheet of compliant latex rubber is now applied over a polyimide template placed on top of the laminations following their stack-up on a tooling plate. Upon the application of pressure in an isostatic lamination procedure, the sheet of latex rubber acts to safely transfer laminating pressure to the cavities formed in the composite substrate structure without rounding the corners or edges thereof.

Abstract: The difficulty with integrating packaged devices into a dual composite module design for wafer scale devices is the height difference between the WSI and packaged devices a typical wafer scale device is 0.025 (in) high while typical packaged VLSI components are 0.080 (in) or more. This leaves little room for the other 5 layers of interconnect boards and PCI layers required for the dual composite module. The solution is that the PWB on the side of the composite heat sink has been shortened to support only the wafer scale device on the heat sink. This eliminated PWB thickness and PCI interfaces from the side with the VLSI components. Also 3-P connectors are made with a pressure contact interconnecting (PCI) board.