Patents by Inventor Scott Pallady

Scott Pallady has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing and testing optical devices, including thin film filters
    Patent number: 7045370
    Abstract: A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: May 16, 2006
    Assignee: JDS Uniphase Corporation
    Inventors: Douglas E. Crafts, Mark Moravec, Scott Pallady
  • Dicing and testing optical devices, including thin film filters
    Publication number: 20030036212
    Abstract: A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.
    Type: Application
    Filed: October 9, 2002
    Publication date: February 20, 2003
    Applicant: JDS UNIPHASE CORPORATION
    Inventors: Douglas E. Crafts, Mark Moravec, Scott Pallady
  • Apparatus and method for dicing and testing optical devices, including thin film filters
    Patent number: 6483174
    Abstract: A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: November 19, 2002
    Assignee: JDS Uniphase Corporation
    Inventors: Douglas E. Crafts, Mark Moravec, Scott Pallady