Abstract: A method of monitoring the voltage transmitted through a pair of electrical connector devices is provided. The pair of electrical connector devices include a source connector coupled to a power supply and a load connector coupled to a load, the source connector being coupled to the load connector. The method includes determining the voltage utilized by the load, determining the voltage generated by the power supply, and determining an electrical resistance of the pair of electrical connectors using the determined voltage utilized by the load and the voltage generated by the power supply. A connector monitoring circuit and a portable X-ray detector including the connector monitoring circuit is also provided.

Abstract: A portable imaging detector and a method for operating the portable imaging detector are provided. The portable imaging detector includes a docking connector having a plurality of docking connector contacts. The method includes measuring a voltage at a first docking connector contact, and determining whether the portable detector is (i) operating in a digital cassette mode or is (ii) installed in either a cassette holder or a charging bin using the measured voltage. A detector state monitoring system is also discussed.

Abstract: A portable imaging detector and a method for operating the portable imaging detector are provided. The portable imaging detector includes a docking connector having a plurality of docking connector contacts. The method includes measuring a voltage at a first docking connector contact, and determining whether the portable detector is (i) operating in a digital cassette mode or is (ii) installed in either a cassette holder or a charging bin using the measured voltage. A detector state monitoring system is also discussed.

Abstract: A method of monitoring the voltage transmitted through a pair of electrical connector devices is provided. The pair of electrical connector devices include a source connector coupled to a power supply and a load connector coupled to a load, the source connector being coupled to the load connector. The method includes determining the voltage utilized by the load, determining the voltage generated by the power supply, and determining an electrical resistance of the pair of electrical connectors using the determined voltage utilized by the load and the voltage generated by the power supply. A connector monitoring circuit and a portable X-ray detector including the connector monitoring circuit is also provided.

Abstract: Systems, methods and apparatus are provided through which in some embodiments, a mobile digital electronic imaging system includes an adapter operable to transmit a digital image to a network. In some embodiments, a network is operable to receive a digital image from a mobile digital electronic imaging system and perform functions upon the digital image, such as display the image or perform processing on the image.

Abstract: Systems, methods and apparatus are provided through which a solid-state X-Ray detector is electronically scrubbed and a flat-field X-Ray exposure of the solid-state X-Ray detector is simulated in reference to an adjusted bias of the solid-state X-Ray detector. The simulation yields a gain image of the solid-state X-Ray detector which is in turn suitable for calibrating the solid-state X-Ray detector without projecting an X-Ray beam onto the solid-state X-Ray detector.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: A system and method for collecting x-ray exposure data in an x-ray detector include scanning pixels in an x-ray detector to determine exposure levels. The scanning may progress sequentially from a first edge to an opposite edge or may progress in an alternating fashion across the detector. The detector may include a data line split, where an object may be positioned between the data line split and an x-ray source. The scanning may then progress sequentially from at least one detector edge towards the data line split. In addition, a system for collecting x-ray exposure data in an x-ray detector is described. The system includes a detector, a plurality of data lines and scan lines, and a programmable logic device. The programmable logic device communicates at least one of a scan line driver module direction signal, an enable scan line driver module signal, and a cascade signal.

Abstract: Systems and methods are provided for managing power consumption of a medical imaging detector by the use of triggering signals, environmental condition data, and/or determination of a variable time interval triggering event that is unique for each power consumption state. Systems and methods are provided for managing power and temperature of a device, after receiving a request for a function to be performed by the device determining an “on” trigger component, an “off” trigger component, associated circuits for performing the received function, providing power to the associated circuits upon the occurrence of the “on” trigger component, and removing power to the associated circuits upon the occurrence of the “off” trigger component. Further, an instruction is described for determining and displaying a variable time interval that is indicative of a time to change from one state to a desired state.

Abstract: Systems and methods are provided for managing power consumption of a medical imaging detector by the use of triggering signals, environmental condition data, and/or determination of a variable time interval triggering event that is unique for each power consumption state. Systems and methods are provided for managing power and temperature of a device, after receiving a request for a function to be performed by the device determining an “on” trigger component, an “off” trigger component, associated circuits for performing the received function, providing power to the associated circuits upon the occurrence of the “on” trigger component, and removing power to the associated circuits upon the occurrence of the “off” trigger component. Further, an instruction is described for determining and displaying a variable time interval that is indicative of a time to change from one state to a desired state.

Abstract: Certain embodiments provide a method and system for improved x-ray image data acquisition using a digital x-ray detector. The method and system include defining groups of scan lines in a detector, associating data lines in the detector with the groups of scan lines, and reading image data from the groups of scan lines using the associated data lines. The scan lines are connected with a plurality of pixels. A region of interest may be defined in the detector. The pixels obtain image data regarding the region of interest. The image data may be read from at least one scan line in each of the groups of scan lines using the associated data lines. Alternatively, the image data may be read from alternating groups of the scan lines using the associated data lines. Image data may also be binned from adjacent pixels read using a plurality of data lines.

Abstract: An x-ray detector (50) includes multiple pixels that receive x-rays. The x-ray detector (50) includes a split scan line (52) that activates the pixels and a data line (54) that conducts charge indicative of the x-rays.

Abstract: A method of maintaining an initial bias of an x-ray detector (12) includes setting the initial bias of the x-ray detector. Operating state of a readout circuit (30) is altered. A photodiode common contact voltage potential is adjusted by a data line drift amount to approximately maintain the initial bias. An x-ray imaging system (10) includes a detector (12) that has multiple pixels, multiple data lines (50), and a common contact (62) that is at a common contact voltage potential. The readout circuit (30) is electrically coupled to the data lines (50) and has a multiple power states. A controller (36) is electrically coupled to the readout circuit (30), detects a change in operating state of the readout circuit (30), and adjusts voltage potential of the common contact (62) in response to the change in operating state.

Abstract: A method and apparatus for correcting electronic offset and gain variations in solid state x-ray detectors includes dedicating rows at the end of an x-ray detector scan. The dedicated rows may be used to measure the “signal” induced by electronic offset and gain variations in solid state x-ray detectors. The first row may be used to measure the signal induced by electronic offset. The second row may be used to measure to signal induced by gain variations. Measurements of the induced signals taken from the dedicated rows may be used to eliminate structured artifacts from the x-ray image.

Abstract: A preferred embodiment of the present invention provides a method and apparatus for correcting the offset induced by Field Effect Transistor (FET) photo-conductive effects in a solid state X-ray detector. The method and apparatus include reading out twice as many rows (scan lines) as actually exist in the X-ray detector. The additional rows may be read out between the actuation of “real” scan lines on the X-ray detector. The additional row times may be used to measure the “signal” induced by FET photo-conductivity. In a preferred embodiment, the “real” rows may be actuated during odd lines, and even lines will be used to measure the signal induced by FET photo-conductivity. To correct for the offset induced by photo-conductive FETs, an even row signal may be subtracted from the preceding odd row signal. The correction for the offset induced by photo-conductive FETs may occur in addition to normal offset correction.