Patents by Inventor Scott R. Cheyne
Scott R. Cheyne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9526192Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.Type: GrantFiled: September 22, 2014Date of Patent: December 20, 2016Assignee: Raytheon CompanyInventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
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Patent number: 9441404Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.Type: GrantFiled: August 24, 2012Date of Patent: September 13, 2016Assignee: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne
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Patent number: 9167714Abstract: A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.Type: GrantFiled: April 22, 2013Date of Patent: October 20, 2015Assignee: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Dennis W. Mercier
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Patent number: 9116222Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.Type: GrantFiled: July 3, 2014Date of Patent: August 25, 2015Assignee: Raytheon CompanyInventors: Joseph R. Ellsworth, Michael P. Martinez, Craig H. McCordic, Jeffrey Paquette, Scott R. Cheyne
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Publication number: 20150013939Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.Type: ApplicationFiled: September 22, 2014Publication date: January 15, 2015Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
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Publication number: 20140314514Abstract: A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.Type: ApplicationFiled: April 22, 2013Publication date: October 23, 2014Applicant: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Dennis W. Mercier
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Patent number: 8839519Abstract: A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.Type: GrantFiled: November 16, 2009Date of Patent: September 23, 2014Assignee: Raytheon CompanyInventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
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Patent number: 8810448Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.Type: GrantFiled: September 12, 2011Date of Patent: August 19, 2014Assignee: Raytheon CompanyInventors: Joseph R. Ellsworth, Michael P. Martinez, Craig H. McCordic, Jeffrey Paquette, Scott R. Cheyne
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Patent number: 8537552Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.Type: GrantFiled: September 25, 2009Date of Patent: September 17, 2013Assignee: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan
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Patent number: 8508943Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.Type: GrantFiled: October 16, 2009Date of Patent: August 13, 2013Assignee: Raytheon CompanyInventors: Paul A. Danello, Scott R. Cheyne, Joseph R. Ellsworth, Thomas J. Tellinghuisen
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Patent number: 8363413Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.Type: GrantFiled: September 13, 2010Date of Patent: January 29, 2013Assignee: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth
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Patent number: 8355255Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.Type: GrantFiled: December 22, 2010Date of Patent: January 15, 2013Assignee: Raytheon CompanyInventors: Scott R. Cheyne, Jeffrey Paquette, Mark Ackerman
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Publication number: 20120314370Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.Type: ApplicationFiled: August 24, 2012Publication date: December 13, 2012Applicant: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne
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Patent number: 8270169Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.Type: GrantFiled: May 13, 2009Date of Patent: September 18, 2012Assignee: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne
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Publication number: 20120162922Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Applicant: Raytheon CompanyInventors: Scott R. Cheyne, Jeffrey Paquette, Mark Ackerman
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Publication number: 20120146862Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.Type: ApplicationFiled: October 16, 2009Publication date: June 14, 2012Applicant: Raytheon CompanyInventors: Paul A. Danello, Scott R. Cheyne, Joseph R. Ellsworth, Thomas J. Tellinghuisen
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Publication number: 20120063098Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.Type: ApplicationFiled: September 13, 2010Publication date: March 15, 2012Applicant: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth
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Publication number: 20110212639Abstract: A circuit card assembly connector system includes a circuit card assembly and an edge connector including a set of resilient, spaced, conductive contacts electrically isolated from each other and extending from a surface of and over an edge of the circuit card assembly; an interconnection system for circuit card assemblies may include at least first and second circuit card assemblies, at least one having such an edge connector for interconnecting with a set of contacts of the other circuit card assembly.Type: ApplicationFiled: February 26, 2010Publication date: September 1, 2011Inventors: Jeffrey Paquette, Scott R. Cheyne, Craig C. Lemmler
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Publication number: 20110114289Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.Type: ApplicationFiled: November 16, 2009Publication date: May 19, 2011Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
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Publication number: 20110075377Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.Type: ApplicationFiled: September 25, 2009Publication date: March 31, 2011Applicant: Raytheon CopanyInventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan