Patents by Inventor Scott Raby

Scott Raby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8166642
    Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: May 1, 2012
    Assignee: The Boeing Company
    Inventors: Peter T. Heisen, Scott A. Raby
  • Patent number: 8081134
    Abstract: A modularly expandable, phased array antenna having a rhomboidal shaped antenna aperture formed by a plurality of rhomboidal shaped subarrays. Each subarray has a rhomboidal shaped printed wiring board on which is formed a plurality of antenna elements, where the elements collectively form a rhomboidal shape in accordance with the printed wiring board. The rhomboidal shaped subarrays enable a modular aperture to be formed without producing any gaps between columns or rows of adjacently positioned subarrays. Thus, a uniform, consistent spacing is maintained between all the antenna elements on the subarrays. This improves antenna radiation and low observability performance for the antenna system, as well as reducing the overall size of the antenna aperture and its cost of construction.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: December 20, 2011
    Assignee: The Boeing Company
    Inventors: Scott A. Raby, Robert T. Worl, Dan R. Miller, David L. Mohoric, Randy L. Ternes
  • Patent number: 7889135
    Abstract: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: February 15, 2011
    Assignee: The Boeing Company
    Inventors: Bruce Larry Blaser, Peter Timothy Heisen, Richard N. Bostwick, John B. O'Connell, Stephen Lee Fahley, Julio A. Navarro, Mark Richard Davis, Harold Peter Soares, Jr., Scott A. Raby, Jimmy S. Takeuchi
  • Patent number: 7884768
    Abstract: A dual beam electronically scanned phased array antenna architecture including a plurality of antenna modules orthogonally connected to a signal distribution board. Each module includes a radiator board orthogonally connected to a first end of a support mandrel. Each radiator board includes RF radiators and a pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Each module includes a signal transfer board formed to fit around a second end of the mandrel such that it is compressed between the mandrel and the signal distribution board, and a pair of signal distribution bridges mounted to the opposing sides of the mandrel. Each signal distribution bridge interconnects respective chip carriers with the signal transfer board and distributes digital, DC and/or RE signals received from the signal transfer board to a plurality of beam scanning circuits included in the respective chip carrier.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: February 8, 2011
    Assignee: The Boeing Company
    Inventors: Julio A. Navarro, Peter T. Heisen, Scott A. Raby, Ming Chen, Lixin Cai
  • Publication number: 20100043223
    Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.
    Type: Application
    Filed: November 5, 2009
    Publication date: February 25, 2010
    Applicant: The Boeing Company
    Inventors: Peter T. Heisen, Scott A. Raby
  • Patent number: 7629538
    Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: December 8, 2009
    Assignee: The Boeing Company
    Inventors: Peter T. Heisen, Scott A. Raby
  • Publication number: 20090135085
    Abstract: A modularly expandable, phased array antenna having a rhombic shaped antenna aperture formed by a plurality of rhombic shaped subarrays. Each subarray has a rhombic shaped printed wiring board on which is formed a plurality of antenna elements, where the elements collectively form a rhombic shape in accordance with the printed wiring board. The rhombic shaped subarrays enable a modular aperture to be formed without producing any gaps between columns or rows of adjacently positioned subarrays. Thus, a uniform, consistent spacing is maintained between all the antenna elements on the subarrays. This improves antenna radiation and low observability performance for the antenna system, as well as reducing the overall size of the antenna aperture and its cost of construction.
    Type: Application
    Filed: September 17, 2007
    Publication date: May 28, 2009
    Inventors: Scott A. Raby, Robert T. Worl, Dan R. Miller, David L. Mohoric, Randy L. Ternes
  • Publication number: 20080316139
    Abstract: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Inventors: Bruce Larry Blaser, Peter Timothy Heisen, Richard N. Bostwick, John B. O'Connell, Stephen Lee Fahley, Julio A. Navarro, Mark Richard Davis, Harold Peter Soares, JR., Scott A. Raby, Jimmy S. Takeuchi
  • Patent number: 7388756
    Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: June 17, 2008
    Assignee: The Boeing Company
    Inventors: Robert T. Worl, Bruce L. Blaser, Peter T. Heisen, Julio A. Navarro, Douglas A. Pietila, Scott A. Raby, Jimmy S. Takeuchi
  • Publication number: 20080137317
    Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 12, 2008
    Inventors: Robert T. Worl, Bruce L. Blaser, Peter T. Heisen, Julio A. Navarro, Douglas A. Pietila, Scott A. Raby, Jimmy S. Takeuchi
  • Publication number: 20080110020
    Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.
    Type: Application
    Filed: November 10, 2006
    Publication date: May 15, 2008
    Inventors: Peter T. Heisen, Scott A. Raby
  • Publication number: 20080106484
    Abstract: A dual beam electronically scanned phased array antenna architecture is provided. The architecture includes a plurality of antenna modules substantially orthogonally connected to a signal distribution board. Each module includes a radiator board substantially orthogonally connected to a first end of a support mandrel. Each radiator board includes a plurality of radio frequency (RF) radiating elements. Each module additionally includes pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Furthermore, each module includes signal transfer board formed to fit around a second end of the mandrel such that the signal transfer board is compressed between the mandrel the signal distribution board. Each module further includes a pair of signal distribution bridges mounted to the opposing sides of the mandrel.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 8, 2008
    Inventors: Julio A. Navarro, Peter T. Heisen, Scott A. Raby, Ming Chen, Lixin Cai
  • Patent number: 7109935
    Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: September 19, 2006
    Assignee: The Boeing Company
    Inventors: Jonathan M. Saint Clair, Julio A. Navarro, Derek E. Iverson, Scott A. Raby
  • Publication number: 20060033663
    Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.
    Type: Application
    Filed: August 10, 2004
    Publication date: February 16, 2006
    Inventors: Jonathan Saint Clair, Julio Navarro, Derek Iverson, Scott Raby