Patents by Inventor Scott Raby
Scott Raby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8166642Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.Type: GrantFiled: November 5, 2009Date of Patent: May 1, 2012Assignee: The Boeing CompanyInventors: Peter T. Heisen, Scott A. Raby
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Patent number: 8081134Abstract: A modularly expandable, phased array antenna having a rhomboidal shaped antenna aperture formed by a plurality of rhomboidal shaped subarrays. Each subarray has a rhomboidal shaped printed wiring board on which is formed a plurality of antenna elements, where the elements collectively form a rhomboidal shape in accordance with the printed wiring board. The rhomboidal shaped subarrays enable a modular aperture to be formed without producing any gaps between columns or rows of adjacently positioned subarrays. Thus, a uniform, consistent spacing is maintained between all the antenna elements on the subarrays. This improves antenna radiation and low observability performance for the antenna system, as well as reducing the overall size of the antenna aperture and its cost of construction.Type: GrantFiled: September 17, 2007Date of Patent: December 20, 2011Assignee: The Boeing CompanyInventors: Scott A. Raby, Robert T. Worl, Dan R. Miller, David L. Mohoric, Randy L. Ternes
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Patent number: 7889135Abstract: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.Type: GrantFiled: June 19, 2007Date of Patent: February 15, 2011Assignee: The Boeing CompanyInventors: Bruce Larry Blaser, Peter Timothy Heisen, Richard N. Bostwick, John B. O'Connell, Stephen Lee Fahley, Julio A. Navarro, Mark Richard Davis, Harold Peter Soares, Jr., Scott A. Raby, Jimmy S. Takeuchi
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Patent number: 7884768Abstract: A dual beam electronically scanned phased array antenna architecture including a plurality of antenna modules orthogonally connected to a signal distribution board. Each module includes a radiator board orthogonally connected to a first end of a support mandrel. Each radiator board includes RF radiators and a pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Each module includes a signal transfer board formed to fit around a second end of the mandrel such that it is compressed between the mandrel and the signal distribution board, and a pair of signal distribution bridges mounted to the opposing sides of the mandrel. Each signal distribution bridge interconnects respective chip carriers with the signal transfer board and distributes digital, DC and/or RE signals received from the signal transfer board to a plurality of beam scanning circuits included in the respective chip carrier.Type: GrantFiled: November 8, 2006Date of Patent: February 8, 2011Assignee: The Boeing CompanyInventors: Julio A. Navarro, Peter T. Heisen, Scott A. Raby, Ming Chen, Lixin Cai
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Publication number: 20100043223Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.Type: ApplicationFiled: November 5, 2009Publication date: February 25, 2010Applicant: The Boeing CompanyInventors: Peter T. Heisen, Scott A. Raby
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Patent number: 7629538Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.Type: GrantFiled: November 10, 2006Date of Patent: December 8, 2009Assignee: The Boeing CompanyInventors: Peter T. Heisen, Scott A. Raby
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Publication number: 20090135085Abstract: A modularly expandable, phased array antenna having a rhombic shaped antenna aperture formed by a plurality of rhombic shaped subarrays. Each subarray has a rhombic shaped printed wiring board on which is formed a plurality of antenna elements, where the elements collectively form a rhombic shape in accordance with the printed wiring board. The rhombic shaped subarrays enable a modular aperture to be formed without producing any gaps between columns or rows of adjacently positioned subarrays. Thus, a uniform, consistent spacing is maintained between all the antenna elements on the subarrays. This improves antenna radiation and low observability performance for the antenna system, as well as reducing the overall size of the antenna aperture and its cost of construction.Type: ApplicationFiled: September 17, 2007Publication date: May 28, 2009Inventors: Scott A. Raby, Robert T. Worl, Dan R. Miller, David L. Mohoric, Randy L. Ternes
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Publication number: 20080316139Abstract: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.Type: ApplicationFiled: June 19, 2007Publication date: December 25, 2008Inventors: Bruce Larry Blaser, Peter Timothy Heisen, Richard N. Bostwick, John B. O'Connell, Stephen Lee Fahley, Julio A. Navarro, Mark Richard Davis, Harold Peter Soares, JR., Scott A. Raby, Jimmy S. Takeuchi
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Patent number: 7388756Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.Type: GrantFiled: December 12, 2006Date of Patent: June 17, 2008Assignee: The Boeing CompanyInventors: Robert T. Worl, Bruce L. Blaser, Peter T. Heisen, Julio A. Navarro, Douglas A. Pietila, Scott A. Raby, Jimmy S. Takeuchi
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Publication number: 20080137317Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.Type: ApplicationFiled: December 12, 2006Publication date: June 12, 2008Inventors: Robert T. Worl, Bruce L. Blaser, Peter T. Heisen, Julio A. Navarro, Douglas A. Pietila, Scott A. Raby, Jimmy S. Takeuchi
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Publication number: 20080110020Abstract: The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.Type: ApplicationFiled: November 10, 2006Publication date: May 15, 2008Inventors: Peter T. Heisen, Scott A. Raby
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Publication number: 20080106484Abstract: A dual beam electronically scanned phased array antenna architecture is provided. The architecture includes a plurality of antenna modules substantially orthogonally connected to a signal distribution board. Each module includes a radiator board substantially orthogonally connected to a first end of a support mandrel. Each radiator board includes a plurality of radio frequency (RF) radiating elements. Each module additionally includes pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Furthermore, each module includes signal transfer board formed to fit around a second end of the mandrel such that the signal transfer board is compressed between the mandrel the signal distribution board. Each module further includes a pair of signal distribution bridges mounted to the opposing sides of the mandrel.Type: ApplicationFiled: November 8, 2006Publication date: May 8, 2008Inventors: Julio A. Navarro, Peter T. Heisen, Scott A. Raby, Ming Chen, Lixin Cai
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Patent number: 7109935Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.Type: GrantFiled: August 10, 2004Date of Patent: September 19, 2006Assignee: The Boeing CompanyInventors: Jonathan M. Saint Clair, Julio A. Navarro, Derek E. Iverson, Scott A. Raby
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Publication number: 20060033663Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.Type: ApplicationFiled: August 10, 2004Publication date: February 16, 2006Inventors: Jonathan Saint Clair, Julio Navarro, Derek Iverson, Scott Raby