Patents by Inventor Scott Richard Cyr

Scott Richard Cyr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor memory device including output buffer
    Patent number: 10199363
    Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: February 5, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Wataru Tsukada, Masayuki Honda, Yoshihisa Fukushima, Scott Richard Cyr
  • SEMICONDUCTOR MEMORY DEVICE INCLUDING OUTPUT BUFFER
    Publication number: 20170256527
    Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.
    Type: Application
    Filed: May 19, 2017
    Publication date: September 7, 2017
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Wataru Tsukada, Masayuki Honda, Yoshihisa Fukushima, Scott Richard Cyr
  • Semiconductor memory device including output buffer
    Patent number: 9691744
    Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 27, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Wataru Tsukada, Masayuki Honda, Yoshihisa Fukushima, Scott Richard Cyr
  • SEMICONDUCTOR MEMORY DEVICE INCLUDING OUTPUT BUFFER
    Publication number: 20160064366
    Abstract: A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 3, 2016
    Inventors: Wataru Tsukada, Masayuki Honda, Yoshihisa Fukushima, Scott Richard Cyr