Patents by Inventor Scott (Richard) List

Scott (Richard) List has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070287263
    Abstract: The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.
    Type: Application
    Filed: August 23, 2007
    Publication date: December 13, 2007
    Inventors: Mauro Kobrinsky, Shriram Ramanathan, Scott (Richard) List
  • Patent number: 7307005
    Abstract: The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: December 11, 2007
    Assignee: Intel Corporation
    Inventors: Mauro J. Kobrinsky, Shriram Ramanathan, Scott (Richard) List