Patents by Inventor Scott Runnels

Scott Runnels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forced-flow wafer polisher
    Patent number: 5783497
    Abstract: A forced-flow polishing technique forcibly flows slurry across the surface of a wafer. The slurry and the wafer are contained in a confined space so that the slurry flow is between a fixed upper and lower boundaries. The slurry flow places selective stress on wafer features such that taller surfaces are eroded at a faster rate. The constant flow allows for uniformity in achieving the selective erosion across the wafer surface.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: July 21, 1998
    Assignee: Sematech, Inc.
    Inventors: Scott Runnels, Anthony J. Toprac
  • Pulsed-force chemical mechanical polishing
    Patent number: 5562530
    Abstract: A pulsed-force CMP scheme allows for the down force holding a wafer onto a pad to cycle periodically between minimum and maximum values. When the force is near its minimum value, slurry flows into the space between the wafer and the pad. When the force is near its maximum value, slurry is squeezed out allowing for the abrasive action of the pad surface to erode wafer surface features.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: October 8, 1996
    Assignee: Sematech, Inc.
    Inventors: Scott Runnels, L. Michael Eyman