Abstract: Integrally bonded composite polyurethane foams substantially free from coalescence and with no discernable bond or structural interface layer when viewed at 50×magnification can be formed by wet casting a second foamed polyurethane composition onto a first wet cast foamed polyurethane composition and simultaneously curing the cast foams. In a preferred embodiment, one curable polyurethane composition forms a slow recovery foam and the other curable polyurethane composition forms a resilient foam.

Abstract: Nickel acetyl acetonate catalysts used in the manufacture of polyurethanes and particularly polyurathane foam, is replaced with a more environmentally friendly organo-metallic catalyst, specifically other metal acetyl acetonates such as iron or copper. In accordance with an important feature of this invention, in addition to the metal acetyl acetonate, the catalyst system also includes acetyl acetone. The acetyl acetone acts as a delay mechanism to delay the catalytic action of the metal acetyl acetonate which is normally highly catalytic at relatively low temperatures. It will be appreciated that high catalytic activity at relatively low temperature will lead to deleterious premature cure. By adding acetyl acetone into the catalyst system, the acetyl acetone acts to delay and/or slow the catalytic action of the metal acetyl acetonate until the polyurethane is heated at which point the acetyl acetone is driven off and the metal acetyl acetonate then provides a relatively fast cure at the elevated temperature.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

Abstract: Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

Abstract: A circuit board electrical interconnection system, including improved, elongated, bodily-rotatable interconnect elements, is disclosed. Each element has tab portions projection angularly from the opposing ends of the element, which tab portions define a pair of pad engagement surfaces. The pad engagement surfaces engage corresponding contact pads on opposing surfaces of two circuit boards by means of elastic support member. The element is divided longitudinally, axially or laterally into a plurality of sectors. Some sectors are electrically conductive, while others have other electrically predetermined characteristics. The two types of sectors are arranged in an alternating patter. The non-conducting sectors may be comprised of insulative, resistive or capacitive materials.

Abstract: Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

Abstract: A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.

Abstract: An electrical connector system for electrically interconnecting an integrated circuit chip unit having a plurality of arrays of first contacts arranged in a first pattern of peripheral form with a circuit board having a plurality of planar arrays of second contact pads arranged in a second pattern of peripheral form. The connector system includes a module member adapted to support the integrated circuit chip unit over the pattern of the circuit board, a plurality of rigid contact carrier members, and a plurality of multi-conductor flexible circuit structures extending between respective portions of the first and second peripheral patterns.

Abstract: An electrical connector system for electrically interconnecting electrically conductive paths of a first circuit with corresponding electrically conductive paths of a second circuit. The system includes backer structure with guide structure that is adapted to receive a first circuit which has a first array of pad-type contacts, and a cooperating connector assembly component that includes contact carrier structure with camming structure and that is adapted to receive a second circuit which has a second array of pad-type contacts corresponding to the pad-type contacts of the first array, and actuator structure that includes camming structure for interaction with camming structure of the contact carrier structure. Elastomeric foam structure interconnects the actuator and said contact carrier structures in a manner enabling the camming structures to engage.

Abstract: An epoxy foam product is presented which is produced by frothing in an intensive mixer an epoxy functional reactant stream and a curing agent stream in the presence of a surfactant and gaseous frothing agent. The epoxy foam product is characterized as a strong, rigid low-density foam having a fine, uniform cell size.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.