Abstract: A microelectronic inductor, a method of fabricating the inductor, and a system incorporating the inductor. The inductor comprises a pair of supporting layers; a high inductance soft magnetic core disposed between the supporting layers; and conductive windings provided about the magnetic core, the windings including a system of interconnected conductive vias and conductive traces, the vias extending through the supporting layers and the magnetic core and the conductive traces being disposed to interconnect the vias. The inductor may be discrete or embedded into a substrate by being patterned thereon.

Abstract: Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active circuitry (e.g., a flash memory array or logic circuitry) on an upper surface of the first die. The semiconducting device further includes a spacer that covers the active circuitry on the upper surface of the first die and a second die that is stacked onto the spacer and the first die. The spacer extends from a first side of the first die to an opposing second side of the first die. The spacer also extends near a third side of the first die and an opposing fourth side of the first die such that the active circuitry is exposed near the third and fourth sides of the first die.