Abstract: A reconstituted-leather-manufacturing process includes a progressively increasing application of pressure to an aqueous leather solution to form a web of leather fibers. The solution/web may be dewatered to an extent before the first application of a pressure so that the solution/web consistency is on the order 29-55% (fiber to web/solution, by weight) when the first pressure of the progressive sequence of pressures is applied. Tannin (and various chemicals) may be added to the solution. The progressive pressing of the solution/web may be followed by a progressive drying of the web by application of a sequence of increasing temperatures via drying vessels.

Abstract: The present application provides enhanced antigen presenting cells comprising an agent that enhances the viability and/or function of the antigen presenting cell and/or an antigen and/or an adjuvant, methods of manufacturing such modified antigen presenting cells, and methods of using such modified antigen presenting cells, such as for modulating an immune response in an individual.

Abstract: Systems and methods may be provided for obtaining and providing patient medication history. The systems and methods may include receiving a request for medication history information of a patient, the request including identification information for the patient. At least one memory may be accessed utilizing at least a portion of the identification information, the at least one memory including information associated with pharmacy claims transactions stored in the at least one memory in near real time as the pharmacy claims transactions are processed. Information associated with the medication history of the patient is obtained from the at least one memory and communicated in response to the received request.

Abstract: A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.