Patents by Inventor Scott Sauer

Scott Sauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220282343
    Abstract: A reconstituted-leather-manufacturing process includes a progressively increasing application of pressure to an aqueous leather solution to form a web of leather fibers. The solution/web may be dewatered to an extent before the first application of a pressure so that the solution/web consistency is on the order 29-55% (fiber to web/solution, by weight) when the first pressure of the progressive sequence of pressures is applied. Tannin (and various chemicals) may be added to the solution. The progressive pressing of the solution/web may be followed by a progressive drying of the web by application of a sequence of increasing temperatures via drying vessels.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 8, 2022
    Applicant: Omnia Advanced Materials LLC
    Inventors: Scott Sauer, Peter Gendreau
  • Publication number: 20210388390
    Abstract: The present application provides enhanced antigen presenting cells comprising an agent that enhances the viability and/or function of the antigen presenting cell and/or an antigen and/or an adjuvant, methods of manufacturing such modified antigen presenting cells, and methods of using such modified antigen presenting cells, such as for modulating an immune response in an individual.
    Type: Application
    Filed: October 3, 2019
    Publication date: December 16, 2021
    Inventors: Howard BERNSTEIN, Matt BOOTY, Luke CASSEREAU, Jonathan CHOW, Kelan HLAVATY, Scott LOUGHHEAD, Melissa MYINT, Scott SAUER, Armon SHAREI, Vidhya VIJAYAKUMAR
  • Patent number: 6818477
    Abstract: A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: November 16, 2004
    Assignee: Powerwave Technologies, Inc.
    Inventors: William K. Veitschegger, Scott Sauer