Patents by Inventor Scott Schaeffer

Scott Schaeffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250169509
    Abstract: This invention relates to compositions and methods for improving plant health, wherein a plant is heterologously disposed to one or more endophytes, or derived from a plant element heterologously disposed to one or more endophytes.
    Type: Application
    Filed: March 3, 2023
    Publication date: May 29, 2025
    Inventors: Victoria KNIGHT-CONNONI, Scott SCHAEFFER, Rebecca RYAN, Zhanshan DONG
  • Publication number: 20150037476
    Abstract: Methods and compositions to temporarily delay the ripening, maturation, senescence and pathogen infection of produce such as fruits, vegetables and ornamental plants are provided. The methods involve the application of a photosynthetic pigment and/or membrane stabilizing chemical (e.g. glycine betaine) to produce which is identified as in need of such delay. Application may be prior to harvest, at or during harvest or post-harvest.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 5, 2015
    Inventors: Amit DHINGRA, Scott SCHAEFFER
  • Patent number: 8901039
    Abstract: Methods and compositions to temporarily delay the ripening, maturation, senescence and pathogen infection of produce such as fruits, vegetables and ornamental plants are provided. The methods involve the application of a photosynthetic pigment and/or membrane stabilizing chemical (e.g. glycine betaine) to produce which is identified as in need of such delay. Application may be prior to harvest, at or during harvest or post-harvest.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 2, 2014
    Assignee: Washington State University
    Inventors: Amit Dhingra, Scott Schaeffer
  • Patent number: 8397796
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: March 19, 2013
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 8230907
    Abstract: A flexible heat pipe for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe includes a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: July 31, 2012
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Publication number: 20100181056
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Application
    Filed: April 1, 2010
    Publication date: July 22, 2010
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Publication number: 20100170661
    Abstract: A flexible heat pipe is disclosed for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe comprises a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Application
    Filed: January 18, 2010
    Publication date: July 8, 2010
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Patent number: 7690419
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: April 6, 2010
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 7663901
    Abstract: Memory modules and methods for fabricating and implementing memory modules wherein unique device parameters corresponding to specific memory devices on the memory modules are accessed from a database such that the device parameters may be implemented to improve system performance. The device parameters may include sizes, speeds, operating voltages, or timing parameters of the memory modules. Memory modules comprising a number of volatile memory devices may be fabricated. Device parameters corresponding to the specific memory devices on the memory module may be stored in a database and accessed during fabrication or during implementation of the memory modules in a system. System performance may be optimized by implementing the unique device parameters corresponding to the specific memory devices on the memory modules.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: February 16, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Jeffery W. Janzen, Scott Schaeffer, Todd D. Farrell
  • Patent number: 7647961
    Abstract: A flexible heat pipe is disclosed for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe comprises a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: January 19, 2010
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Patent number: 7044199
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: May 16, 2006
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 6131650
    Abstract: The apparatus is an easily assembled, fluid cooled, single phase heat sink. The heat sink is constructed of only four simple parts, a pan shaped casing, a simple thermally conductive porous pad, a manifold block with channels, and a lid. The lid includes input and output fluid holes which are interconnected to sets of alternating channels in the manifold block, so that adjacent channels are isolated from each other and are connected to only either the input or the output holes. Thus, the only access between the adjacent input and output channels is through the porous pad which is sandwiched between the manifold block and the bottom of the casing. Fluid flow through the porous pad thereby cools the entire bottom of the casing which is held in heat transfer relationship with a heat source.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: October 17, 2000
    Assignee: Thermal Corp.
    Inventors: Mark T. North, John H. Rosenfeld, David L. Muth, Brian D. Fritsch, C. Scott Schaeffer