Patents by Inventor Scott Simpson
Scott Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8429450Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.Type: GrantFiled: May 28, 2010Date of Patent: April 23, 2013Assignee: Vision Solutions, Inc.Inventors: David E. Brown, Scott Simpson
-
Publication number: 20110155946Abstract: A method of manufacturing a polymer foam composite is described, the method comprising forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, and a filler composition comprising a plurality of magnetic, electrically conductive particles; foaming the precursor composition to form a plurality of cells in precursor composition; applying a magnetic field to the foamed precursor composition, wherein the magnetic field is of a strength and applied for a time effective to align the electrically conductive, magnetic particles into mutually isolated chains between the first surface and the opposite second surface of the article; and solidifying the polymer foam precursor composition to provide a polymer foam composite having a density of about 1 to about 125 pounds per cubic foot and a volume resistivity of about 10?3 ohm-cm to about 103 ohm-cm at a pressure of 60 pounds per square inch.Type: ApplicationFiled: August 5, 2008Publication date: June 30, 2011Applicant: WORLD PROPERTIES, INC.Inventor: Scott Simpson
-
Patent number: 7875345Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.Type: GrantFiled: February 6, 2008Date of Patent: January 25, 2011Assignee: World Properties, Inc.Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
-
Publication number: 20110006267Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.Type: ApplicationFiled: February 6, 2008Publication date: January 13, 2011Applicant: WORLD PROPERTIES, INC.Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
-
Patent number: 7815998Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.Type: GrantFiled: February 6, 2008Date of Patent: October 19, 2010Assignee: World Properties, Inc.Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
-
Publication number: 20100241896Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.Type: ApplicationFiled: May 28, 2010Publication date: September 23, 2010Inventors: David E. Brown, Scott Simpson
-
Patent number: 7757116Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.Type: GrantFiled: April 4, 2007Date of Patent: July 13, 2010Assignee: Vision Solutions, Inc.Inventors: David E. Brown, Scott Simpson
-
Patent number: 7575476Abstract: A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.Type: GrantFiled: August 1, 2007Date of Patent: August 18, 2009Assignee: Tyco Electronics CorporationInventors: Adam P. Tyler, Douglas Scott Simpson, Yezdi N. Soonavala
-
Patent number: 7494348Abstract: A cable termination to a power distribution module includes a power distribution module housing having a conductive mounting tube extending therefrom. The mounting tube includes a main bore extending therethrough for receiving a main power cable. A main power cable is received within the main bore, wherein the main power cable includes at least one wire extending into the power distribution module housing. The main power cable includes a cylindrical shield element surrounding the at least one wire. A spring element engages the shield element and biases the shield element into engagement with the mounting tube to electrically common the shield element and the housing.Type: GrantFiled: August 1, 2007Date of Patent: February 24, 2009Assignee: Tyco Electronics CorporationInventors: Adam P. Tyler, Douglas Scott Simpson, Aaron J. de Chazal, Andre E. Guanco, Yezdi N. Soonavala
-
Publication number: 20090035974Abstract: A cable termination to a power distribution module includes a power distribution module housing having a conductive mounting tube extending therefrom. The mounting tube includes a main bore extending therethrough for receiving a main power cable. A main power cable is received within the main bore, wherein the main power cable includes at least one wire extending into the power distribution module housing. The main power cable includes a cylindrical shield element surrounding the at least one wire. A spring element engages the shield element and biases the shield element into engagement with the mounting tube to electrically common the shield element and the housing.Type: ApplicationFiled: August 1, 2007Publication date: February 5, 2009Inventors: Adam P. Tyler, Douglas Scott Simpson, Aaron J. de Chazal, Andre E. Guanco, Yezdi N. Soonavala
-
Publication number: 20090034165Abstract: A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.Type: ApplicationFiled: August 1, 2007Publication date: February 5, 2009Inventors: Adam P. Tyler, Douglas Scott Simpson, Yezdi N. Soonavala
-
Publication number: 20080311378Abstract: A method of manufacturing a polymer foam composite is described, the method comprising forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, and a filler composition comprising a plurality of magnetic, electrically conductive particles; foaming the precursor composition to form a plurality of cells in precursor composition; applying a magnetic field to the foamed precursor composition, wherein the magnetic field is of a strength and applied for a time effective to align the electrically conductive, magnetic particles into mutually isolated chains between the first surface and the opposite second surface of the article; and solidifying the polymer foam precursor composition to provide a polymer foam composite having a density of about 1 to about 125 pounds per cubic foot and a volume resistivity of about 10?3 ohm-cm to about 103 ohm-cm at a pressure of 60 pounds per square inch.Type: ApplicationFiled: August 5, 2008Publication date: December 18, 2008Inventor: Scott SIMPSON
-
Publication number: 20080250267Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.Type: ApplicationFiled: April 4, 2007Publication date: October 9, 2008Inventors: David E. Brown, Scott Simpson
-
Publication number: 20080213565Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.Type: ApplicationFiled: February 6, 2008Publication date: September 4, 2008Applicant: WORLD PROPERTIES, INC.Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
-
Publication number: 20070148409Abstract: A silicone grip comprising a cured silicone film layer with a Shore A Durometer of less than or equal to about 60 wherein the silicone film layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule. The cured silicone layer is used in combination with an adhesive to provide a flexible and malleable grip, and/or in combination with a backing layer that can be solid or foamed.Type: ApplicationFiled: August 2, 2006Publication date: June 28, 2007Inventors: Victor Rios, Robert Daigle, Walter Paciorek, Karen Phifer, Dave Sherman, Scott Simpson
-
Patent number: 7193620Abstract: A wireless device lighting system provides backlighting of a display (104) and/or a user interface (1526) of a wireless device (100). A user interface (1526) includes a plurality of buttons (112) for entering information and at least one multicolor LED for emitting light. The at least one multicolor LED is located behind the plurality of buttons (112). The user interface (1526) further includes a connector for connecting the user interface (1526) to the wireless device (100) and a circuit board for mounting the at least one multicolor LED and the connector. The user interface (1526) further includes a light pipe for allowing light emitted from the at least one multicolor LED to be emitted from the buttons (112), the light pipe located between the at least one multicolor LED and the buttons (112). The user interface (1526) further includes a selector for allowing a user to define a color of light for emission by the at least one multicolor LED.Type: GrantFiled: July 21, 2003Date of Patent: March 20, 2007Assignee: Motorola, Inc.Inventors: Bach L. Nguyen, Julio C. Castaneda, Humberto E. Garcia, Jose Felix Rodriguez, Brian Scott Simpson, Erik J. Walls, Jeffrey Michael Buczek
-
Publication number: 20060025493Abstract: A method for producing a cured, low-density polyurethane foam, the method comprises frothing a reactive polyurethane-forming composition comprising an isocyanate-containing component, an active hydrogen-containing component reactive with the isocyanate-containing component, a blowing agent, a surfactant, and catalyst system, wherein the catalyst system provides for a delayed curing of the foam; casting the frothed reactive polyurethane-forming composition onto a first carrier; placing a second carrier on a side of the cast foam opposite the first carrier; blowing the froth with the second carrier in place; and curing the blown froth so as to provide a polyurethane foam layer having a density of about 50 to about 400 kg/m3 and a thickness of about 0.3 to about 13 mm. The foams are useful as sealing members.Type: ApplicationFiled: August 9, 2005Publication date: February 2, 2006Inventors: Scott Simpson, Tadashi Sato
-
Patent number: 5065281Abstract: A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.Type: GrantFiled: February 12, 1990Date of Patent: November 12, 1991Assignee: Rogers CorporationInventors: Jorge M. Hernandez, Scott Simpson
-
Patent number: 5009607Abstract: A flexible circuit connector is presented which is used to electrically and mechanically connect a flexible circuit to a circuit board or other electronic device. The connector also functions to wipe off any residue or debris on the electrical contacts before final connection. The connector is comprised of a male plug and a female adapter. The male plug comprises two interlocking pieces including a block and a cover. These two pieces allow for easy assembly and disassembly of the plug in conjunction with a flexible circuit. The female adapter comprises a hood which may be fastened directly to a circuit board. Alternatively, the hood may be fastened to a base plate which has gold plated contacts and conductive pins which pass through and which are soldered to the circuit board.Type: GrantFiled: July 24, 1989Date of Patent: April 23, 1991Assignee: Rogers CorporationInventors: Herman B. Gordon, Mark J. Owens, Leon Rubinstein, Scott Simpson
-
Patent number: 4913656Abstract: An electrical connector is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits and another circuit device in a compact package with allowance for very tight tolerances on pad width and spacing.Type: GrantFiled: April 7, 1989Date of Patent: April 3, 1990Assignee: Rogers CorporationInventors: Herman B. Gordon, Mark J. Owens, Scott Simpson