Patents by Inventor Scott Simpson

Scott Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8429450
    Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: April 23, 2013
    Assignee: Vision Solutions, Inc.
    Inventors: David E. Brown, Scott Simpson
  • Publication number: 20110155946
    Abstract: A method of manufacturing a polymer foam composite is described, the method comprising forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, and a filler composition comprising a plurality of magnetic, electrically conductive particles; foaming the precursor composition to form a plurality of cells in precursor composition; applying a magnetic field to the foamed precursor composition, wherein the magnetic field is of a strength and applied for a time effective to align the electrically conductive, magnetic particles into mutually isolated chains between the first surface and the opposite second surface of the article; and solidifying the polymer foam precursor composition to provide a polymer foam composite having a density of about 1 to about 125 pounds per cubic foot and a volume resistivity of about 10?3 ohm-cm to about 103 ohm-cm at a pressure of 60 pounds per square inch.
    Type: Application
    Filed: August 5, 2008
    Publication date: June 30, 2011
    Applicant: WORLD PROPERTIES, INC.
    Inventor: Scott Simpson
  • Patent number: 7875345
    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: January 25, 2011
    Assignee: World Properties, Inc.
    Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
  • Publication number: 20110006267
    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
    Type: Application
    Filed: February 6, 2008
    Publication date: January 13, 2011
    Applicant: WORLD PROPERTIES, INC.
    Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
  • Patent number: 7815998
    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: October 19, 2010
    Assignee: World Properties, Inc.
    Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
  • Publication number: 20100241896
    Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.
    Type: Application
    Filed: May 28, 2010
    Publication date: September 23, 2010
    Inventors: David E. Brown, Scott Simpson
  • Patent number: 7757116
    Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: July 13, 2010
    Assignee: Vision Solutions, Inc.
    Inventors: David E. Brown, Scott Simpson
  • Patent number: 7575476
    Abstract: A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: August 18, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Adam P. Tyler, Douglas Scott Simpson, Yezdi N. Soonavala
  • Patent number: 7494348
    Abstract: A cable termination to a power distribution module includes a power distribution module housing having a conductive mounting tube extending therefrom. The mounting tube includes a main bore extending therethrough for receiving a main power cable. A main power cable is received within the main bore, wherein the main power cable includes at least one wire extending into the power distribution module housing. The main power cable includes a cylindrical shield element surrounding the at least one wire. A spring element engages the shield element and biases the shield element into engagement with the mounting tube to electrically common the shield element and the housing.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: February 24, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Adam P. Tyler, Douglas Scott Simpson, Aaron J. de Chazal, Andre E. Guanco, Yezdi N. Soonavala
  • Publication number: 20090035974
    Abstract: A cable termination to a power distribution module includes a power distribution module housing having a conductive mounting tube extending therefrom. The mounting tube includes a main bore extending therethrough for receiving a main power cable. A main power cable is received within the main bore, wherein the main power cable includes at least one wire extending into the power distribution module housing. The main power cable includes a cylindrical shield element surrounding the at least one wire. A spring element engages the shield element and biases the shield element into engagement with the mounting tube to electrically common the shield element and the housing.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 5, 2009
    Inventors: Adam P. Tyler, Douglas Scott Simpson, Aaron J. de Chazal, Andre E. Guanco, Yezdi N. Soonavala
  • Publication number: 20090034165
    Abstract: A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 5, 2009
    Inventors: Adam P. Tyler, Douglas Scott Simpson, Yezdi N. Soonavala
  • Publication number: 20080311378
    Abstract: A method of manufacturing a polymer foam composite is described, the method comprising forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, and a filler composition comprising a plurality of magnetic, electrically conductive particles; foaming the precursor composition to form a plurality of cells in precursor composition; applying a magnetic field to the foamed precursor composition, wherein the magnetic field is of a strength and applied for a time effective to align the electrically conductive, magnetic particles into mutually isolated chains between the first surface and the opposite second surface of the article; and solidifying the polymer foam precursor composition to provide a polymer foam composite having a density of about 1 to about 125 pounds per cubic foot and a volume resistivity of about 10?3 ohm-cm to about 103 ohm-cm at a pressure of 60 pounds per square inch.
    Type: Application
    Filed: August 5, 2008
    Publication date: December 18, 2008
    Inventor: Scott SIMPSON
  • Publication number: 20080250267
    Abstract: Hyperclusters are a cluster of clusters. Each cluster has associated with it one or more resource groups, and independent node failures within the clusters are handled by platform specific clustering software. The management of coordinated failovers across dependent or independent resources running on heterogeneous platforms is contemplated. A hypercluster manager running on all of the nodes in a cluster communicates with platform specific clustering software regarding any failure conditions, and utilizing a rule-based decision making system, determines actions to take on the node. A plug-in extends exit points definable in non-hypercluster clustering technologies. The failure notification is passed to other affected resource groups in the hypercluster.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: David E. Brown, Scott Simpson
  • Publication number: 20080213565
    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
    Type: Application
    Filed: February 6, 2008
    Publication date: September 4, 2008
    Applicant: WORLD PROPERTIES, INC.
    Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
  • Publication number: 20070148409
    Abstract: A silicone grip comprising a cured silicone film layer with a Shore A Durometer of less than or equal to about 60 wherein the silicone film layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule. The cured silicone layer is used in combination with an adhesive to provide a flexible and malleable grip, and/or in combination with a backing layer that can be solid or foamed.
    Type: Application
    Filed: August 2, 2006
    Publication date: June 28, 2007
    Inventors: Victor Rios, Robert Daigle, Walter Paciorek, Karen Phifer, Dave Sherman, Scott Simpson
  • Patent number: 7193620
    Abstract: A wireless device lighting system provides backlighting of a display (104) and/or a user interface (1526) of a wireless device (100). A user interface (1526) includes a plurality of buttons (112) for entering information and at least one multicolor LED for emitting light. The at least one multicolor LED is located behind the plurality of buttons (112). The user interface (1526) further includes a connector for connecting the user interface (1526) to the wireless device (100) and a circuit board for mounting the at least one multicolor LED and the connector. The user interface (1526) further includes a light pipe for allowing light emitted from the at least one multicolor LED to be emitted from the buttons (112), the light pipe located between the at least one multicolor LED and the buttons (112). The user interface (1526) further includes a selector for allowing a user to define a color of light for emission by the at least one multicolor LED.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: March 20, 2007
    Assignee: Motorola, Inc.
    Inventors: Bach L. Nguyen, Julio C. Castaneda, Humberto E. Garcia, Jose Felix Rodriguez, Brian Scott Simpson, Erik J. Walls, Jeffrey Michael Buczek
  • Publication number: 20060025493
    Abstract: A method for producing a cured, low-density polyurethane foam, the method comprises frothing a reactive polyurethane-forming composition comprising an isocyanate-containing component, an active hydrogen-containing component reactive with the isocyanate-containing component, a blowing agent, a surfactant, and catalyst system, wherein the catalyst system provides for a delayed curing of the foam; casting the frothed reactive polyurethane-forming composition onto a first carrier; placing a second carrier on a side of the cast foam opposite the first carrier; blowing the froth with the second carrier in place; and curing the blown froth so as to provide a polyurethane foam layer having a density of about 50 to about 400 kg/m3 and a thickness of about 0.3 to about 13 mm. The foams are useful as sealing members.
    Type: Application
    Filed: August 9, 2005
    Publication date: February 2, 2006
    Inventors: Scott Simpson, Tadashi Sato
  • Patent number: 5065281
    Abstract: A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.
    Type: Grant
    Filed: February 12, 1990
    Date of Patent: November 12, 1991
    Assignee: Rogers Corporation
    Inventors: Jorge M. Hernandez, Scott Simpson
  • Patent number: 5009607
    Abstract: A flexible circuit connector is presented which is used to electrically and mechanically connect a flexible circuit to a circuit board or other electronic device. The connector also functions to wipe off any residue or debris on the electrical contacts before final connection. The connector is comprised of a male plug and a female adapter. The male plug comprises two interlocking pieces including a block and a cover. These two pieces allow for easy assembly and disassembly of the plug in conjunction with a flexible circuit. The female adapter comprises a hood which may be fastened directly to a circuit board. Alternatively, the hood may be fastened to a base plate which has gold plated contacts and conductive pins which pass through and which are soldered to the circuit board.
    Type: Grant
    Filed: July 24, 1989
    Date of Patent: April 23, 1991
    Assignee: Rogers Corporation
    Inventors: Herman B. Gordon, Mark J. Owens, Leon Rubinstein, Scott Simpson
  • Patent number: 4913656
    Abstract: An electrical connector is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits and another circuit device in a compact package with allowance for very tight tolerances on pad width and spacing.
    Type: Grant
    Filed: April 7, 1989
    Date of Patent: April 3, 1990
    Assignee: Rogers Corporation
    Inventors: Herman B. Gordon, Mark J. Owens, Scott Simpson