Patents by Inventor Scott Solberg
Scott Solberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11026719Abstract: An introducer sheath may include a tubular member comprising an inner layer and an outer layer coaxially disposed about a central longitudinal axis of the introducer sheath, the tubular member being configured to shift between an unexpanded configuration to an expanded configuration. The inner layer may be circumferentially discontinuous along at least a portion of its length. At least a first portion of the inner layer may be configured to move circumferentially relative to the outer layer when shifting between the unexpanded and expanded configurations.Type: GrantFiled: May 15, 2018Date of Patent: June 8, 2021Assignee: Boston Scientific Scimed, Inc.Inventors: Michael Richmon Thoreson, Adam David Grovender, Scott Solberg, David Raab, Benjamin Philip Gundale, Ross A. Olson, James M. Anderson
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Publication number: 20190083083Abstract: An example introducer is disclosed. The example introducer includes a sheath having an inner surface and a wall having a thickness, a liner disposed along the inner surface of the sheath, the liner including at least one folded portion and a first lumen positioned in the thickness of the wall, wherein the first lumen is positioned adjacent to the at least one folded portion.Type: ApplicationFiled: September 21, 2018Publication date: March 21, 2019Applicant: BOSTON SCIENTIFIC SCIMED, INC.Inventors: Anthony Frank Tassoni, JR., James M. Anderson, Adam David Grovender, Michael Richmon Thoreson, Scott Solberg, Austin Farrell Ost, Peter John Hoffman, David Raab, Brian R. Reynolds
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Publication number: 20190083082Abstract: An example introducer is disclosed. The example introducer includes a sheath having an inner surface and a wall having a thickness, a liner disposed along the inner surface of the sheath, the liner including at least one folded portion and a first lumen positioned in the thickness of the wall, wherein the first lumen is positioned adjacent to the at least one folded portion.Type: ApplicationFiled: September 21, 2018Publication date: March 21, 2019Applicant: BOSTON SCIENTIFIC SCIMED, INC.Inventors: Anthony Frank Tassoni, JR., James M. Anderson, Adam David Grovender, Michael Richmon Thoreson, Scott Solberg, Austin Farrell Ost, Peter John Hoffman, David Raab, Brian R. Reynolds
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Publication number: 20180325549Abstract: An introducer sheath may include a tubular member comprising an inner layer and an outer layer coaxially disposed about a central longitudinal axis of the introducer sheath, the tubular member being configured to shift between an unexpanded configuration to an expanded configuration. The inner layer may be circumferentially discontinuous along at least a portion of its length. At least a first portion of the inner layer may be configured to move circumferentially relative to the outer layer when shifting between the unexpanded and expanded configurations.Type: ApplicationFiled: May 15, 2018Publication date: November 15, 2018Applicant: BOSTON SCIENTIFIC SCIMED, INC.Inventors: Michael Richmon Thoreson, Adam David Grovender, Scott Solberg, David Raab, Benjamin Philip Gundale, Ross A. Olson, James M. Anderson
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Patent number: 8021311Abstract: Medical devices and methods for manufacturing medical devices. An example manufacturing method includes providing a metallic tubular member having a inner surface with a metal oxide layer disposed thereon, mechanically scoring and/or removing a portion of the metal oxide layer to create a bonding zone along the inner surface, and soldering an additional metallic structural element to the bonding zone.Type: GrantFiled: August 16, 2006Date of Patent: September 20, 2011Assignee: Boston Scientific Scimed, Inc.Inventors: Michael Munoz, Scott Solberg
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Publication number: 20080097248Abstract: Medical devices and methods for manufacturing medical devices. An example manufacturing method includes providing a metallic tubular member having a inner surface with a metal oxide layer disposed thereon, mechanically scoring and/or removing a portion of the metal oxide layer to create a bonding zone along the inner surface, and soldering an additional metallic structural element to the bonding zone.Type: ApplicationFiled: August 16, 2006Publication date: April 24, 2008Inventors: Michael Munoz, Scott Solberg
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Publication number: 20070117234Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.Type: ApplicationFiled: December 15, 2006Publication date: May 24, 2007Applicant: Xerox CorporationInventors: David Fork, Scott Solberg, Karl Littau
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Publication number: 20070057748Abstract: Various traveling wave grid configurations are disclosed. The grids and systems are well suited for transporting, separating, and classifying small particles dispersed in liquid or gaseous media. Also disclosed are various separation strategies and purification cells utilizing such traveling wave arrays and strategies.Type: ApplicationFiled: September 12, 2005Publication date: March 15, 2007Inventors: Meng Lean, Jeng Lu, Scott Limb, Jurgen Daniel, Armin Volkel, Huangpin Hsieh, Scott Solberg, Bryan Preas
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Patent number: 7172707Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.Type: GrantFiled: January 5, 2005Date of Patent: February 6, 2007Assignee: Xerox CorporationInventors: David K. Fork, Scott Solberg, Karl A. Littau
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Publication number: 20060211217Abstract: A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.Type: ApplicationFiled: December 20, 2004Publication date: September 21, 2006Inventors: Baomin Xu, Steven Buhler, William Wong, Michael Weisberg, Scott Solberg, Karl Littau, Scott Elrod
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Publication number: 20060103695Abstract: A liquid drop ejector comprising a jet stack, thin film or thick film heaters formed on the surface of the jet stack, and at least one thin film or thick film temperature sensor operative to provide feedback temperature control for the thin film or thick film heater elements is provided. In one form, the liquid drop ejector also has the thin film or thick film heater elements grouped in segments that are operative to be individually controlled. In addition, in another form, the signal lines provided to the liquid drop ejector are patterned to allow for more uniform resistance over the span of the liquid drop ejector.Type: ApplicationFiled: November 15, 2004Publication date: May 18, 2006Inventors: Michael Young, Steven Buhler, Scott Limb, Karl Littau, Beverly Russo, Scott Solberg, Michael Weisberg, Cathie Burke, Richard Schmachtenberg, Peter Nystrom, Sharon Berger, Timothy Trang, Thomas Long
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Patent number: 7042015Abstract: A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.Type: GrantFiled: August 8, 2001Date of Patent: May 9, 2006Assignee: Xerox CorporationInventors: Decai Sun, Eric Peeters, Christopher L. Chua, Francesco Lemmi, Patrick Y. Maeda, Scott Solberg
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Publication number: 20050191518Abstract: A thin film device comprises: a substrate and a thin film having a thickness formed on the substrate, wherein the thickness of the thin film is at least 1 micrometer, a crystal structure having crystals with a grain size formed within the thin film, wherein the grain size of a majority of the crystals includes a height to width ratio greater than three to two.Type: ApplicationFiled: March 31, 2005Publication date: September 1, 2005Inventor: Scott Solberg
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Publication number: 20050162045Abstract: A material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 ?m to 100 ?m. The at least one thick film element structure is bonded to a second substrate. Thereafter, the first substrate is removed from the at least one thick film element structure using a liftoff process which includes emitting, from a radiation source (such as a laser or other appropriate device), a beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the surface of the first substrate. The first substrate is substantially transparent at the wavelength of the beam, and the beam generates sufficient energy at the interface to break the attachment.Type: ApplicationFiled: March 18, 2005Publication date: July 28, 2005Inventors: Baomin Xu, Steven Buhler, Michael Welsberg, William Wong, Scott Solberg, Karl Littau, John Fitch, Scott Elrod
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Publication number: 20050159002Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.Type: ApplicationFiled: January 5, 2005Publication date: July 21, 2005Applicant: Xerox CorporationInventors: David Fork, Scott Solberg, Karl Littau
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Publication number: 20050104479Abstract: A piezoelectric thick film element array includes at least one piezoelectric element structure having a thickness between 10 ?m to 100 ?m formed by a deposition process. The at least one piezoelectric element is patterned during the deposition process, and includes a first electrode deposited on a first surface of the piezoelectric elements structure, and a second electrode deposited on a second surface of the piezoelectric element structure. In a further embodiment, several devices are provided using a piezoelectric element or an array having a piezoelectric element structure with a thickness of between 10 ?m to 100 ?m formed by a deposition process. These devices include microfluidic ejectors, transducer arrays and catheters.Type: ApplicationFiled: December 20, 2004Publication date: May 19, 2005Inventors: Baomin Xu, Steven Buhler, Michael Welsberg, William Wong, Scott Solberg, Karl Littau, John Fitch, Scott Elrod
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Patent number: 6866255Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film information to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.Type: GrantFiled: April 12, 2002Date of Patent: March 15, 2005Assignee: Xerox CorporationInventors: David K. Fork, Scott Solberg, Karl Littau
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Publication number: 20030192476Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.Type: ApplicationFiled: April 12, 2002Publication date: October 16, 2003Applicant: Xerox CorporationInventors: David K. Fork, Scott Solberg, Karl Littau
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Publication number: 20020003231Abstract: A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.Type: ApplicationFiled: August 8, 2001Publication date: January 10, 2002Applicant: XEROX CORPORATIONInventors: Decai Sun, Eric Peeters, Christopher L. Chua, Francesco Lemmi, Patrick Y. Maeda, Scott Solberg