Patents by Inventor Scott Sperl
Scott Sperl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10420643Abstract: A prosthetic device for attachment to a vascular structure includes a body with an axial length configured to be adjustable by manipulation of at least one design feature but not materially affected by simple luminal pressurization. The at least one design feature includes at least one of a reducing mechanism or a purse-string provided along at least part of a circumference of the body to actuate reduction of a diameter of the device. The prosthetic device may include a body with an axial length configured to be adjustable and at least one roll-down segment at one end of the body. The at least one roll-down segment may be configured to be facilitated or supported by integrated shape memory materials to maintain the roll-down characteristics.Type: GrantFiled: December 12, 2016Date of Patent: September 24, 2019Assignee: Corfigo, Inc.Inventor: Jason Scott Sperling
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Publication number: 20170086964Abstract: A prosthetic device for attachment to a vascular structure includes a body with an axial length configured to be adjustable by manipulation of at least one design feature but not materially affected by simple luminal pressurization. The at least one design feature includes at least one of a reducing mechanism or a purse-string provided along at least part of a circumference of the body to actuate reduction of a diameter of the device. The prosthetic device may include a body with an axial length configured to be adjustable and at least one roll-down segment at one end of the body. The at least one roll-down segment may be configured to be facilitated or supported by integrated shape memory materials to maintain the roll-down characteristics.Type: ApplicationFiled: December 12, 2016Publication date: March 30, 2017Inventor: Jason Scott Sperling
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Publication number: 20120215072Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.Type: ApplicationFiled: May 1, 2012Publication date: August 23, 2012Applicant: JASON SCOTT SPERLINGInventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
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Patent number: 8167798Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.Type: GrantFiled: January 22, 2010Date of Patent: May 1, 2012Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
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Patent number: 8118989Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.Type: GrantFiled: August 11, 2011Date of Patent: February 21, 2012Assignee: Honeywell International Inc.Inventors: Don Mittendorf, Scott Sperl
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Publication number: 20110293845Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Don Mittendorf, Scott Sperl
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Patent number: 7998594Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.Type: GrantFiled: February 11, 2008Date of Patent: August 16, 2011Assignee: Honeywell International Inc.Inventors: Don Mittendorf, Scott Sperl
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Publication number: 20110071351Abstract: A device for evaluating an aortic valve after opening an aorta distal to the aortic valve includes a body defining a chamber. The body has a generally circular proximal open end and a distal end, the proximal open end being configured to be reversibly attachable to one of the aorta and a short open tube distal to the aortic valve in a generally water-tight fashion. At least a portion of the body is transparent to view the aortic valve. Other embodiments of the device and related methods are further disclosed.Type: ApplicationFiled: September 23, 2010Publication date: March 24, 2011Inventor: Jason Scott Sperling
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Publication number: 20100185059Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.Type: ApplicationFiled: January 22, 2010Publication date: July 22, 2010Applicant: Jason Scott SperlingInventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
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Patent number: 7651465Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.Type: GrantFiled: March 7, 2006Date of Patent: January 26, 2010Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
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Publication number: 20090202863Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.Type: ApplicationFiled: February 11, 2008Publication date: August 13, 2009Applicant: Honeywell International Inc.Inventors: Don Mittendorf, Scott Sperl
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Publication number: 20060163521Abstract: A hot gas valve disc for a divert and attitude control disc switching element used in a propelled craft. The hot gas valve disc comprises a first layer comprising a first metal material having a first grain size and a first grain orientation, and at least one additional layer comprising a second metal material having a second grain size that differs from the first grain size, or a second grain orientation that differs from the first grain orientation. A method of manufacturing the hot gas valve disc comprises the steps of fabricating a first metal layer using a solid-free-form fabrication process, the first metal layer having a set of grain characteristics comprising grain size and grain structure, followed by heating the first layer and thereby changing at least one of the grain characteristics.Type: ApplicationFiled: July 28, 2005Publication date: July 27, 2006Inventors: Robbie Adams, Don Mittendorf, Scott Sperl