Patents by Inventor Scott Sperl

Scott Sperl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10420643
    Abstract: A prosthetic device for attachment to a vascular structure includes a body with an axial length configured to be adjustable by manipulation of at least one design feature but not materially affected by simple luminal pressurization. The at least one design feature includes at least one of a reducing mechanism or a purse-string provided along at least part of a circumference of the body to actuate reduction of a diameter of the device. The prosthetic device may include a body with an axial length configured to be adjustable and at least one roll-down segment at one end of the body. The at least one roll-down segment may be configured to be facilitated or supported by integrated shape memory materials to maintain the roll-down characteristics.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: September 24, 2019
    Assignee: Corfigo, Inc.
    Inventor: Jason Scott Sperling
  • Publication number: 20170086964
    Abstract: A prosthetic device for attachment to a vascular structure includes a body with an axial length configured to be adjustable by manipulation of at least one design feature but not materially affected by simple luminal pressurization. The at least one design feature includes at least one of a reducing mechanism or a purse-string provided along at least part of a circumference of the body to actuate reduction of a diameter of the device. The prosthetic device may include a body with an axial length configured to be adjustable and at least one roll-down segment at one end of the body. The at least one roll-down segment may be configured to be facilitated or supported by integrated shape memory materials to maintain the roll-down characteristics.
    Type: Application
    Filed: December 12, 2016
    Publication date: March 30, 2017
    Inventor: Jason Scott Sperling
  • Publication number: 20120215072
    Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Applicant: JASON SCOTT SPERLING
    Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
  • Patent number: 8167798
    Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: May 1, 2012
    Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
  • Patent number: 8118989
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: February 21, 2012
    Assignee: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Publication number: 20110293845
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Application
    Filed: August 11, 2011
    Publication date: December 1, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Don Mittendorf, Scott Sperl
  • Patent number: 7998594
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 16, 2011
    Assignee: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Publication number: 20110071351
    Abstract: A device for evaluating an aortic valve after opening an aorta distal to the aortic valve includes a body defining a chamber. The body has a generally circular proximal open end and a distal end, the proximal open end being configured to be reversibly attachable to one of the aorta and a short open tube distal to the aortic valve in a generally water-tight fashion. At least a portion of the body is transparent to view the aortic valve. Other embodiments of the device and related methods are further disclosed.
    Type: Application
    Filed: September 23, 2010
    Publication date: March 24, 2011
    Inventor: Jason Scott Sperling
  • Publication number: 20100185059
    Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.
    Type: Application
    Filed: January 22, 2010
    Publication date: July 22, 2010
    Applicant: Jason Scott Sperling
    Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
  • Patent number: 7651465
    Abstract: A device for expanding an elongate opening formed in a skin layer of a patient includes a first arm for engaging one side of the opening and a second arm for engaging the other side of the opening. The device further includes a spreader mechanism, coupled to at least one of the first and second arms, to move the at least one of the first and second arms to widen the opening. The at least one arm is configured to move between a retracted position in which the at least one arm is positioned next to the other arm and an extended position in which the at least one arm is extended to expand the opening. Other embodiments of the device as well as methods for performing a medical procedure are further disclosed.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: January 26, 2010
    Inventors: Jason Scott Sperling, Jeffrey A. Kinsberg, Cristy J. Richards
  • Publication number: 20090202863
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Application
    Filed: February 11, 2008
    Publication date: August 13, 2009
    Applicant: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Publication number: 20060163521
    Abstract: A hot gas valve disc for a divert and attitude control disc switching element used in a propelled craft. The hot gas valve disc comprises a first layer comprising a first metal material having a first grain size and a first grain orientation, and at least one additional layer comprising a second metal material having a second grain size that differs from the first grain size, or a second grain orientation that differs from the first grain orientation. A method of manufacturing the hot gas valve disc comprises the steps of fabricating a first metal layer using a solid-free-form fabrication process, the first metal layer having a set of grain characteristics comprising grain size and grain structure, followed by heating the first layer and thereby changing at least one of the grain characteristics.
    Type: Application
    Filed: July 28, 2005
    Publication date: July 27, 2006
    Inventors: Robbie Adams, Don Mittendorf, Scott Sperl