Patents by Inventor Scott T. UEDA

Scott T. UEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR DEPOSITION OF HIGHLY SELECTIVE METAL FILMS
    Publication number: 20210398848
    Abstract: The present inventive concept relates to selective metal layer deposition. Embodiments include a method for atomic layer deposition (ALD) of a metal, the method comprising at least one cycle of: a) exposing a substrate, the substrate comprising a surface comprising a metal portion and an insulator portion, to a metal-organic precursor; b) depositing a metal-organic precursor on an upper surface of the metal portion of the substrate to selectively provide a metal precursor layer on the upper surface of the metal portion of the substrate; c) exposing the metal precursor layer to a co-reactant; and d) depositing the co-reactant on the metal precursor layer, wherein the co-reactant takes part in a ligand exchange with the metal precursor layer.
    Type: Application
    Filed: December 3, 2019
    Publication date: December 23, 2021
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Ravindra KANJOLIA, Mansour MOINPOUR, Jacob WOODRUFF, Steven WOLF, Michael BREEDEN, Scott T. UEDA, Andrew KUMMEL, Ashay ANURAG