Abstract: In accordance with the present invention, there are provided heat dispersing articles, assemblies containing same, methods for the preparation thereof, and various uses therefor. In one aspect of the present invention, there are provided heat dispersing articles. In another aspect of the present invention, there are provided methods for producing the above-referenced articles. In yet another aspect of the present invention, there are provided assemblies containing the above-referenced articles. In still another aspect of the present invention, there are provided methods for making the above-referenced assemblies. In yet another aspect, there are provided methods to dissipate the heat generated by portable electronic devices.

Abstract: In accordance with the present invention, there are provided novel assemblies which are useful for a variety of applications. Invention assemblies have low dielectric constant, making them suitable for use in a variety of electronic applications. In addition, invention assemblies are resistant to attack by acidic aqueous media, basic aqueous media and/or organic media, making it possible to subject such assemblies to a variety of processing conditions, such as, for example, chemical etching to introduce circuitry thereto.

Abstract: A positive temperature coefficient (PTC) resistor composition, comprising: (a) about 3% to about 75% by weight of a binder resin, (b) about 0.5% to about 70% by weight of a temperature activatable semicrystalline polymer, which is a thermoplastic elastomer (TPE) that melts at a relatively narrow temperature range to change from a crystalline state to an amorphous state, (c) about 10% to about 80% by weight of an electrically conductive material in finely particulated form selected from the group consisting of silver, graphite, graphite/carbon, nickel, copper, silver coated copper, and aluminum, (d) about 0.01% to about 80% by weight of solvent material for the composition.