Patents by Inventor Scott Tseng

Scott Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040237113
    Abstract: A plug-and-play video transmitting device comprises a converting main machine and a receiver. Wherein the converting main machine includes a first station-selecting control unit, a first control unit, a compressing unit and a first signal receiving and emitting unit; the receiver includes a second signal receiving and emitting unit, a second control unit and a decompressing unit. With these elements, a power line in a socket of a district power supply system carries the television signals and transmits them after they are compressed by the converting main machine; so that a normal television set can synchronically obtain power from a socket of a district power supply system directly through the receiver and decompress the compressed signals. In this way, the effect of convenient assembling and the effect of plug-and-play without arrangement of lines can be obtained.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 25, 2004
    Applicant: Taicom Data Systems Co., Ltd.
    Inventor: Scott Tseng
  • Publication number: 20040112237
    Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.
    Type: Application
    Filed: September 19, 2003
    Publication date: June 17, 2004
    Applicant: SiPix Imaging, Inc.
    Inventors: Yi-Shung Chaug, Xiaojia Wang, Sean Kiluk, Scott Tseng, Hongmei Zang, Rong-Chang Liang
  • Patent number: 5866857
    Abstract: A structure of modem shell with round sound suppression comprises: a box formed by opposite upper and lower half shell bodies, wherein a concave spacing the opening of which is directed outwards is installed thereon, while within the spacing is installed with a line output hole; a covering plate the size of which is enough to cover the opening of the spacing, and a plurality of through holes is installed on the covering surface thereof; and a buckling mechanism is formed by at least two pairs of buckling holes and a pillar; thereby, the spacing is used to locate a trumpet and then is covered by a covering plate so to effectively suppress the round sound generated by the modem.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: February 2, 1999
    Assignee: Taicom Data Systems Co., Ltd.
    Inventor: Scott Tseng