Patents by Inventor Scott V. Voss

Scott V. Voss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating interconnect tape for use in tape automated bonding
    Patent number: 4849857
    Abstract: The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heatsink. The tape leads, the heat dissipating pad and the support members for the heat dissipating pad are all formed from the same electrically conductive strip.
    Type: Grant
    Filed: October 5, 1987
    Date of Patent: July 18, 1989
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Scott V. Voss
  • Heat dissipating interconnect tape for use in tape automated bonding
    Patent number: 4827376
    Abstract: The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.
    Type: Grant
    Filed: December 18, 1987
    Date of Patent: May 2, 1989
    Assignee: Olin Corporation
    Inventor: Scott V. Voss
  • Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
    Patent number: 4806409
    Abstract: A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.
    Type: Grant
    Filed: May 20, 1987
    Date of Patent: February 21, 1989
    Assignee: Olin Corporation
    Inventors: Jackie A. Walter, Brett Sharenow, Robert Walker, Scott V. Voss