Patents by Inventor Scott Van Ness

Scott Van Ness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7387406
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having at least one LED. The module includes a heat conductive body portion adapted to conduct heat generated by the LED away from the LED. As a result, the LED can be operated with a higher current than normally allowed. Thus, LED brightness and performance is increased without decreasing life expectancy. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: June 17, 2008
    Assignee: Permlight Products, Inc.
    Inventors: Jagath Swaris, Scott Van Ness
  • Publication number: 20080028649
    Abstract: An economical method for designing and implementing a computer-controlled illuminated sign from an array or a matrix array of individual light sources.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 7, 2008
    Inventor: Scott Van Ness
  • Patent number: 7108396
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs away from the LEDs. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: September 19, 2006
    Assignee: Permlight Products, Inc.
    Inventors: Jagath Swaris, Scott Van Ness
  • Patent number: 6846093
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: January 25, 2005
    Assignee: Permlight Products, Inc.
    Inventors: Jagath Swaris, Scott Van Ness
  • Publication number: 20030218878
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Application
    Filed: April 16, 2003
    Publication date: November 27, 2003
    Applicant: Permlight Products, Inc.
    Inventors: Jagath Swaris, Scott Van Ness
  • Patent number: 6578986
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: June 17, 2003
    Assignee: Permlight Products, Inc.
    Inventors: Jagath Swaris, Scott Van Ness
  • Publication number: 20030002282
    Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
    Type: Application
    Filed: September 5, 2001
    Publication date: January 2, 2003
    Inventors: Jagath Swaris, Scott Van Ness