Abstract: An apparatus (100) for attaching a surface mount component (102) includes a substrate (104) and a pad (106) carried on the substrate (104) to accommodate attachment of the surface mount component (102). The pad (106) has a central portion (108) and at least two triangular portions (109 and 110) separated by the central portion (108).

Abstract: An apparatus for leveling (136) a circuit board (105) against a rail (128, 130) of a part placement machine (102) comprises a plate (200) and at least one spring (404, 506, 507, 508). The circuit board (105) can have any one of a plurality of different predetermined thicknesses. The plate (200) is positioned beneath the rail (128, 130) and has first and second sides (204, 300). The first side (204) is dimensioned to support the circuit board (105). The plate (200) is moveable to a first predetermined distance from the rail (128, 130). The first predetermined distance is no smaller than a smallest one of the plurality of different predetermined thicknesses of the circuit board (105). The at least one spring (404, 506, 507, 508) is carried on the second side (300) of the plate (200) to bias the plate towards the rail (128, 130). The at least one spring (404, 506, 507, 508) is compressible to accommodate the circuit board (105) between the plate (200) and the rail (128, 130).