Patents by Inventor Scott Willmorth

Scott Willmorth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8709878
    Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: April 29, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Todd Bolken, Scott Willmorth, Bradley Bitz
  • Publication number: 20120135560
    Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.
    Type: Application
    Filed: February 6, 2012
    Publication date: May 31, 2012
    Applicant: Micron Technology, Inc.
    Inventors: Todd BOLKEN, Scott WILLMORTH, Bradley BITZ
  • Patent number: 8110884
    Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: February 7, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Todd Bolken, Scott Willmorth, Bradley Bitz
  • Publication number: 20090152658
    Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Inventors: Todd Bolken, Scott Willmorth, Bradley Bitz