Abstract: Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.

Abstract: A floor pump includes a base, a cylinder, a hose, a valve assembly, a piston rod, and a pressure sensing device. The cylinder is connected with the base. The hose is connected with the base and includes a nozzle attachable with an inflatable. The valve assembly is mounted in the base and connected between the cylinder and the hose. The piston rod connects with a piston slidably disposed and reciprocable inside the chamber for pushing air. The pressure sensing device is disposed in the base. The pressure sensing device can measure the pressure value of the air flowing into the pressure sensing device and is connectable with a mobile electronic device via wireless transmission for indication.

Abstract: A portable pump includes a cylinder, a nozzle, a valve, a piston rod, a tube, and a pressure sensing device. The nozzle connects with the cylinder and includes a passage connectable with the inflatable. The valve is mounted between the cylinder and the nozzle. The piston rod has a rod hole and is connected with a piston and a handle. The handle includes a recess. The tube connected with the valve. The pressure sensing device is disposed in the recess. The pressure sensing device can measure the pressure value of the air flowing into the recess and is connectable with a mobile electronic device via wireless transmission for indication.

Abstract: A floor pump includes a base, a cylinder, a hose assembly, a valve assembly, a piston rod, and a pressure sensing device. The cylinder is mounted on the base. The hose assembly includes a hose, a nozzle, and a recess connected with each other. The valve assembly is mounted in the base and connected between the cylinder and the hose assembly. The piston rod is connected with a piston reciprocable inside the cylinder. The pressure sensing device is disposed in the recess and interconnected with the valve assembly. The pressure sensing device can measure the pressure value of the air flowing into the pressure sensing recess and is connectable with a mobile electronic device via wireless transmission for indicating the air pressure value.

Abstract: Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment.

Abstract: An air valve connector is threadly engaged to a nozzle head of an air pump, which is eccentrically and pivotally connected with a cam lever. The cam lever is adapted to press against a plug and an airtight ring disposed in the nozzle head to compel the valve connector to connect with different types of air valves such as a French type valve, a German type valve, an English type valve, and an American type valve. The air valve connector is reversed easily between first and second positions to be adapted to connect with the different type valves by the user.

Abstract: Embodiments of the present disclosure provide a method comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, electrically coupling one or more dies to the redistribution layer, forming a molding compound on the semiconductor substrate, recessing the second surface of the semiconductor substrate, forming one or more channels through the recessed second surface of the semiconductor substrate to expose the redistribution layer; and forming one or more package interconnect structures in the one or more channels, the one or more package interconnect structures being electrically coupled to the redistribution layer, the one or more package interconnect structures to route electrical signals of the one or more dies. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.

Abstract: Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.

Abstract: An air valve connector is threadly engaged to a nozzle head of an air pump, which is eccentrically and pivotally connected with a cam lever. The cam lever is adapted to press against a plug and an airtight ring disposed in the nozzle head to compel the valve connector to connect with different types of air valves such as a French type valve, a German type valve, a English type valve, and an American type valve. The air valve connector of the present invention is reversed easily between first and second positions to be adapted to connect with the different type valves by the user.

Abstract: A portable direct-circuit sprayer includes a body. The body includes a water chamber therein for containing water, a component chamber therein and with two open sides, and an integrated floor between two portions of the water chamber between which the component chamber is positioned. A pump is installed in the component chamber in order to pressurize the water from the water chamber. A panel shuts one of the open sides of the component chamber. A cover shuts the other open side of the component chamber.

Abstract: A nozzle head, which can be used to pump air into a tire or a shock absorber, includes a housing, a sleeve, and an activating member. The housing is engagable with a pumping mechanism of an air pump. The sleeve is disposed in and rotatable with respect to the housing. The sleeve includes a channel and also includes a first end adapted for receiving an American valve and a second end adapted for receiving a French valve respectively. The activating member is disposed in the sleeve and movable to a first position in which the sleeve includes the first end in fluid communication with the channel and the second end not in fluid communication with the channel and a second position in which the sleeve includes the second end in fluid communication with the channel and the first end not in fluid communication with the channel.

Abstract: A nozzle head includes a housing, an activating member, and a cap. The housing is engagable with a pumping mechanism of an air pump. The housing includes a passage and also includes a first end adapted for receiving an American valve and a second end adapted for receiving a French valve respectively. The activating member is disposed in the housing and movable to a first position in which the housing includes the first end in fluid communication with the passage and the second end not in fluid communication with the passage and a second position in which the housing includes the second end in fluid communication with the passage and the first end not in fluid communication with the passage. The cap is fitted to the first end of the housing and rotatable with respect thereto.

Abstract: A pump nozzle includes a housing body including a lateral edge. The lateral edge defines a valve connecting end and a lever connecting end. A lever is connected to the lever connecting end and is operably pivotal between a first position and a second position. Also, the lever includes a first extension and a second extension extending therefrom and angled thereto. When the lever is in the first position, its first extension is disposed in and adjacent to the lateral edge and is oriented towards the top edge of the housing body, and its second extension is disposed in and adjacent to the top edge and is orientated towards the valve connecting end of the housing body. When the lever is in the second position, the first and second extensions are disposed outside the lateral edge and top edge of the housing body, respectively.

Abstract: A head for an air pump includes a housing, a nozzle, an urging mechanism, and an end cap. The housing includes a first compartment defined therein and including a first end defining an opening port and a second end enclosed by an end wall. The housing further includes a hole extending therethrough and into the first compartment. The nozzle device is disposed within the first compartment. The urging mechanism includes a cam, an axle and a pivoting member. The cam is disposed in the first compartment and abuts against the nozzle device. The axle is inserted into the housing through the holes and engages with the cam. The pivoting member is connected to the cam by engaging with a terminal end of the axle.

Abstract: The technology provides, in some aspects, methods and systems for triggering a master machine vision processor and a slave machine vision processor in a multi-camera machine vision system. Thus, for example, in one aspect, the technology provides a method that includes the steps of establishing a communications link between a slave machine vision processor and a master machine vision processor; receiving on the slave machine vision processor a data message from the master machine vision processor; and triggering the slave machine vision processor to perform a machine vision function, the triggering occurring at a frequency based upon the data message, wherein at least one triggering of the slave machine vision processor occurs independent of the master machine vision processor.

Abstract: Embodiments of the present disclosure provide a substrate having (i) a first laminate layer, (ii) a second laminate layer, and (iii) a core material that is disposed between the first laminate layer and the second laminate layer; and a die attached to the first laminate layer, the die having an interposer bonded to a surface of an active side of the die, the surface comprising (i) a dielectric material and (ii) a bond pad to route electrical signals of the die, the interposer having a via formed therein, the via being electrically coupled to the bond pad to further route the electrical signals of the die, wherein the die and the interposer are embedded in the core material of the substrate. Other embodiments may be described and/or claimed.

Abstract: A mini pump has a head including a connective end, a nozzle and an air channel communicating the connective end with the nozzle. A cylinder assembly is removably engaged with the connective end of the head. A tube is selectively received in the cylinder assembly and has an end connected to the connective end. The head is locked to the cylinder assembly and the tube is concealed in the cylinder assembly when the head is in a first position. The head is disengaged from the cylinder assembly and the tube extends out of the cylinder assembly when the head is in a second position.

Abstract: A nozzle device includes a body, a controller and a core set. The controller is pivotally mounted on the body and is pivotable with respect to the body between a first position and a second position. The core set is slideably received in the body. While the controller is in the first position, the core set is slideable in the chamber and is adapted for coupling with a French type valve. While the controller is in the second position, the core set is fixed and is adapted for coupling with an American type valve.

Abstract: A nozzle device comprises a body, a controller and a core set. The controller is pivotally mounted on the body and is pivotable with respect to the body between a first position and a second position. The core set is slideably received in the body. While the controller is in the first position, the core set is slideable in the chamber and is adapted for coupling with a French type valve. While the controller is in the second position, the core set is fixed and is adapted for coupling with an American type valve.