Patents by Inventor Se-chuel Park
Se-chuel Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210107094Abstract: According to one or more embodiments, there is provided an apparatus for polishing a surface of a substrate to remove a resin layer formed on the surface of the substrate having a groove, the apparatus including: a laser irradiation apparatus configured to irradiate a laser to the resin layer to remove at least a portion of a resin from the resin layer except for a portion of the resin layer arranged in the groove.Type: ApplicationFiled: April 13, 2020Publication date: April 15, 2021Inventors: Sung Il KANG, Se Chuel PARK, Jong Hoe KU, In Seob BAE
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Patent number: 9171789Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.Type: GrantFiled: August 5, 2013Date of Patent: October 27, 2015Assignee: HAESUNG DS CO., LTDInventors: Dong-Il Shin, In-Seob Bae, Se-Chuel Park
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Patent number: 9142495Abstract: The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one surface of the base material, the first metal layer comprising nickel; a second metal layer formed on a surface of the first metal layer, the second metal layer comprising palladium; and a third metal layer formed on a surface of the second metal layer, the third metal layer comprising silver.Type: GrantFiled: December 3, 2012Date of Patent: September 22, 2015Assignee: HAESUNG DS CO., LTD.Inventors: Sung-Kwan Paek, Dong-Il Shin, Se-Chuel Park
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Patent number: 8937378Abstract: A lead frame and a semiconductor package including the lead frame are provided. The lead frame includes: a base material; a first metal layer which is formed on at least one side of the base material, of which a surface is roughly formed, and which includes copper or nickel; a second metal layer which is formed on a surface of the first metal layer, of which a surface is roughly formed, and which includes palladium or a palladium alloy; a third metal layer which is formed on a surface of the second metal layer, of which a surface is roughly formed, and which includes gold or a gold alloy; and a fourth metal layer which is formed on a surface of the third metal layer, of which a surface is roughly formed, and which includes metal that includes silver.Type: GrantFiled: January 11, 2012Date of Patent: January 20, 2015Assignee: MDS Co., Ltd.Inventors: Sung-kwan Paek, Se-chuel Park
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Publication number: 20140319666Abstract: The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one surface of the base material, the first metal layer comprising nickel; a second metal layer formed on a surface of the first metal layer, the second metal layer comprising palladium; and a third metal layer formed on a surface of the second metal layer, the third metal layer comprising silver.Type: ApplicationFiled: December 3, 2012Publication date: October 30, 2014Applicant: MDS CO., LTD.Inventors: Sung-Kwan Paek, Dong-Il Shin, Se-Chuel Park
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Publication number: 20140252580Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.Type: ApplicationFiled: August 5, 2013Publication date: September 11, 2014Applicant: SAMSUNG TECHWIN CO., LTD.Inventors: Dong-Il SHIN, In-Seob BAE, Se-Chuel PARK
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Patent number: 8409726Abstract: Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.Type: GrantFiled: June 1, 2009Date of Patent: April 2, 2013Assignee: Samsung Techwin Co., Ltd.Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
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Publication number: 20120279775Abstract: Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.Type: ApplicationFiled: July 5, 2012Publication date: November 8, 2012Applicant: Samsung Techwin Co., Ltd.Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
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Patent number: 8278564Abstract: Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.Type: GrantFiled: April 30, 2009Date of Patent: October 2, 2012Assignee: Samsung Techwin Co., Ltd.Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
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Publication number: 20120175758Abstract: A lead frame and a semiconductor package including the lead frame are provided. The lead frame includes: a base material; a first metal layer which is formed on at least one side of the base material, of which a surface is roughly formed, and which includes copper or nickel; a second metal layer which is formed on a surface of the first metal layer, of which a surface is roughly formed, and which includes palladium or a palladium alloy; a third metal layer which is formed on a surface of the second metal layer, of which a surface is roughly formed, and which includes gold or a gold alloy; and a fourth metal layer which is formed on a surface of the third metal layer, of which a surface is roughly formed, and which includes metal that includes silver.Type: ApplicationFiled: January 11, 2012Publication date: July 12, 2012Applicant: SAMSUNG TECHWIN CO., LTD.Inventors: Sung-kwan Paek, Se-chuel Park
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Publication number: 20100116528Abstract: Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.Type: ApplicationFiled: June 1, 2009Publication date: May 13, 2010Applicant: Samsung Techwin Co., Ltd.Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
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Publication number: 20090283316Abstract: Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.Type: ApplicationFiled: April 30, 2009Publication date: November 19, 2009Applicant: Samsung Techwin Co., Ltd.Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
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Patent number: 7285845Abstract: A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufacturing the lead frame are provided. The lead frame includes a base metal layer formed of a metal and a plurality of plating layers having different components formed on at least a surface of the base metal layer, wherein the plating layers include, a Ni plating layer deposited on at least a surface of the base metal layer and formed of Ni or an Ni alloy, a Pd plating layer stacked on at least a surface of the Ni plating layer and formed of Pd or a Pd alloy, and a protection plating layer stacked on at least a surface of the Pd plating layer and formed of Au or an Au alloy, wherein the Ni plating layer is formed to have a predetermined a thickness and a surface coarseness.Type: GrantFiled: August 1, 2005Date of Patent: October 23, 2007Assignee: Samsung Techwin Co., Ltd.Inventors: Sung-il Kang, Se-chuel Park
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Patent number: 7268021Abstract: A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of Ni or a Ni alloy on a base metal layer formed of a metal, forming a Pd plating layer formed of Pd or an Pd alloy on the Ni plating layer, heat-treating the Ni plating layer and the Pd plating layer, and forming a protective plating layer on the heat-treated Pd plating layer.Type: GrantFiled: November 4, 2004Date of Patent: September 11, 2007Assignee: Samsung Techwin Co., Ltd.Inventors: Sung-kwan Paek, Se-chuel Park, Sang-hun Lee
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Patent number: 7250671Abstract: Provided is a method for manufacturing a lead frame and a semiconductor package having a semiconductor chip for connecting to an outer board and having a base metal layer formed of iron and nickel as main elements. The method includes preparing the base metal layer of a lead frame, forming one or more plating layers on the base metal layer, mounting the semiconductor chip on the lead frame, molding the semiconductor chip and at least a portion of the lead frame, bending the lead frame to form the lead frame in a predetermined shape, and heat-treating the lead frame for forming a diffusion layer in order to protect the lead frame from corrosion.Type: GrantFiled: February 23, 2005Date of Patent: July 31, 2007Assignee: Samsung Techwin Co., Ltd.Inventors: Sang-hun Lee, Sung-kwan Paek, Se-chuel Park
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Publication number: 20060237824Abstract: A lead frame for a semiconductor package and a manufacturing method thereof are provided. In the lead frame, a Ni plating layer made of Ni or a Ni alloy is plated on a base metallic layer. A Ni—Pd plating layer made of a Ni—Pd based alloy and having a Ni atomic concentration in a range of about 60% to about 95% is plated on the Ni plating layer, and a protective plating layer is plated on the Ni—Pd plating layer.Type: ApplicationFiled: August 11, 2005Publication date: October 26, 2006Applicant: Samsung Techwin Co., Ltd.Inventors: Sang-hun Lee, Se-chuel Park
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Publication number: 20060231931Abstract: A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufacturing the lead frame are provided. The lead frame includes a base metal layer formed of a metal and a plurality of plating layers having different components formed on at least a surface of the base metal layer, wherein the plating layers include, a Ni plating layer deposited on at least a surface of the base metal layer and formed of Ni or an Ni alloy, a Pd plating layer stacked on at least a surface of the Ni plating layer and formed of Pd or a Pd alloy, and a protection plating layer stacked on at least a surface of the Pd plating layer and formed of Au or an Au alloy, wherein the Ni plating layer is formed to have a predetermined a thickness and a surface coarseness.Type: ApplicationFiled: August 1, 2005Publication date: October 19, 2006Applicant: Samsung Techwin Co., Ltd.Inventors: Sung-il Kang, Se-chuel Park
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Publication number: 20050233566Abstract: A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of Ni or a Ni alloy on a base metal layer formed of a metal, forming a Pd plating layer formed of Pd or an Pd alloy on the Ni plating layer, heat-treating the Ni plating layer and the Pd plating layer, and forming a protective plating layer on the heat-treated Pd plating layer.Type: ApplicationFiled: November 4, 2004Publication date: October 20, 2005Inventors: Sung-kwan Paek, Se-chuel Park, Sang-hun Lee
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Publication number: 20050184366Abstract: Provided is a method for manufacturing a lead frame and a semiconductor package having a semiconductor chip for connecting to an outer board and having a base metal layer formed of iron and nickel as main elements. The method includes preparing the base metal layer of a lead frame, forming one or more plating layers on the base metal layer, mounting the semiconductor chip on the lead frame, molding the semiconductor chip and at least a portion of the lead frame, bending the lead frame to form the lead frame in a predetermined shape, and heat-treating the lead frame for forming a diffusion layer in order to protect the lead frame from corrosion.Type: ApplicationFiled: February 23, 2005Publication date: August 25, 2005Inventors: Sang-hun Lee, Sung-kwan Paek, Se-chuel Park