Abstract: The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.

Abstract: The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: A cooling apparatus for power modules includes a manifold cover and a pin plate, and generates vertical turbulent flow of the cooling fluid in such a way as to spray the cooling fluid vertically onto the heat-generating surface using cooling fins of a pin plate configured in the lengthwise and vertical directions of a manifold cover, which ensures cooling efficiency while minimizing flow rate losses caused by the vertical turbulent flow by improving the flow efficiency of the cooling fluid. The manifold cover is provided with a plurality of flow paths for the circulation of the cooling fluid that have different directions respectively for the inflow and the circulation of the cooling fluid and are different in volume or width, minimizing pressure losses during fluid circulation and resolving cooling imbalances through the cooling fins.

Abstract: A power module cooling device includes a manifold cover and a fin plate contained in the manifold cover, wherein a cooling fluid is ejected perpendicularly to heating surfaces through cooling fins of the fin plate configured perpendicularly to the longitudinal direction of the manifold cover so that a vertical turbulent flow of the cooling fluid is generated, thereby securing cooling efficiency, and flow characteristics of the cooling fluid are improved, minimizing flow rate loss due to the vertical turbulent flow. respective cooling channel portions of the manifold cover corresponding to respective power modules have different cooling performances so that respective power modules are cooled in a balanced manner. Accordingly, cooling imbalance is removed, and the power modules are thus stabilized and maintain performance.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: A cooling apparatus of a power module includes a guide provided inside a manifold cover to control a flow of a cooling fluid, wherein the cooling fluid circulated inside the manifold cover forms a vertical turbulent flow by the guide so that cooling efficiency of the power module is secured only using an internal structure of the manifold cover. Thus, heat dissipation performance is improved without a separate fin plate or a separate nozzle injection device.

Abstract: An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.

Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.

Abstract: A cooling apparatus of a power module includes a guide provided inside a manifold cover to control a flow of a cooling fluid, wherein the cooling fluid circulated inside the manifold cover forms a vertical turbulent flow by the guide so that cooling efficiency of the power module is secured only using an internal structure of the manifold cover. Thus, heat dissipation performance is improved without a separate fin plate or a separate nozzle injection device.

Abstract: An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: A double-sided cooling apparatus for a power module, includes a first cooling module provided to be in contact with a first side of the power module to which a switching device is mounted, and allowing cooling fluid to flow therein; and a second cooling module provided to be in contact with a second side of the power module provided opposite to the first side, and including a tube allowing the cooling fluid to flow in the tube, wherein the first cooling module includes a manifold cover including a plurality of cooling channels formed by a plurality of guide walls extending in a first direction, and a fin plate including a plurality of fins extending in a second direction intersecting the first direction, and the cooling channel includes a blocker formed in a predetermined portion of the cooling channel so that the cooling fluid in the first cooling module flows in a mixed form of lateral flow and vertical flow of the cooling fluid.

Abstract: The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.