Patents by Inventor Se Ho MYEONG

Se Ho MYEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
    Publication number: 20240055340
    Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 15, 2024
    Inventors: Se Woong NA, Se Ho MYEONG
  • Printed circuit board and package substrate including same
    Patent number: 11842893
    Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: December 12, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Se Woong Na, Se Ho Myeong
  • PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
    Publication number: 20220262713
    Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 18, 2022
    Inventors: Se Woong NA, Se Ho MYEONG
  • PRINTED CIRCUIT BOARD
    Publication number: 20220264750
    Abstract: The printed circuit board according to the embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface of the first insulating layer or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and to surround the second circuit pattern; wherein the second circuit pattern is an outermost circuit pattern, wherein the second circuit pattern and the second insulating layer are disposed to protrude on the upper surface of the first insulating layer, and wherein a height of the second circuit pattern is greater than a height of the second insulating layer.
    Type: Application
    Filed: July 15, 2020
    Publication date: August 18, 2022
    Inventors: Do Hyuk YOO, Se Woong NA, Se Ho MYEONG