Abstract: The present invention relates to an image encoding and decoding technique, and more particularly, to an image encoder and decoder using unidirectional prediction. The image encoder includes a dividing unit to divide a macro block into a plurality of sub-blocks, a unidirectional application determining unit to determine whether an identical prediction mode is applied to each of the plurality of sub-blocks, and a prediction mode determining unit to determine a prediction mode with respect to each of the plurality of sub-blocks based on a determined result of the unidirectional application determining unit.

Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.

Abstract: A display device includes a display layer including pixels each including at least one transistor, a connection wiring electrically connected to the at least one transistor and exposed to a lower surface of the display layer through a first contact hole in the display layer, a base member disposed under the display layer and including a first hole exposing the connection wiring exposed to the lower surface of the display layer, a first lower protective layer disposed on a lower surface of the base member and including a second hole overlapping the first hole, a pad portion disposed on a lower surface of the first lower protective layer, and a lead line disposed on the lower surface of the first lower protective layer and electrically connecting the pad portion and the connection wiring. A tiled display device includes multiple display devices.

Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.

Abstract: A tiled display includes a first display device comprising a first display area and a first pad area having grooves, and a second display device comprising a second display area and a second pad area overlapping the second display area, the second pad area having protrusions, wherein the protrusions are inserted into the grooves to connect the first pad area with the second pad area.

Abstract: A display device includes a display panel, an organic layer disposed on a surface of the display panel, a polysilazane layer disposed on the organic layer and including a spaced region, and a resin layer disposed in the spaced region of the polysilazane layer. An elastic modulus of the resin layer is lower than an elastic modulus of the polysilazane layer.

Abstract: A display device includes a substrate and a protection film disposed on a rear side of the substrate. The substrate includes a first portion including a display area and having a first width, and a second portion extending from the first portion and having a second width narrower than the first width. The protection film includes a cavity at a border portion of the first portion and the second portion of the substrate.

Abstract: A display device includes a substrate including a first surface and a second surface, pixels and first lines disposed on the first surface of the substrate, a first protective layer disposed on the second surface of the substrate and overlapping the pixels and the first lines, via holes penetrating the substrate and the first protective layer and exposing an area of each of the first lines, second lines disposed on a surface of the first protective layer and electrically connected to the first lines through the via holes, respectively, and pads disposed on the surface of the first protective layer and electrically connected to the second lines, respectively. The first protective layer includes openings corresponding to the via holes and also includes a photoresist material.

Abstract: A display device includes a first substrate including a first contact hole, fan-out lines in a first metal layer, a second substrate on the first metal layer and including a second contact hole, connection lines in a second metal layer and into the second contact hole connected to the fan-out lines, a thin film transistor in an active layer and a third metal layer on the second metal layer, and a flexible film on a surface of the first substrate and into the first contact hole connected to the fan-out lines. An etching angle of the first contact hole between a top surface of the first substrate and an inner surface of the first contact hole is less than an etching angle of the second contact hole between top surfaces of the fan-out lines and an inner surface of the second contact hole.

Abstract: A method for manufacturing a display device according to an embodiment includes: forming a display panel including a first substrate, a second substrate facing the first substrate, an emission layer disposed between the first substrate and the second substrate, a pad portion disposed on the first substrate, and a thin film encapsulation layer disposed on the pad portion; removing the thin film encapsulation layer disposed on the pad portion by using a plasma processing device; and attaching a flexible circuit board on which an integrated circuit chip is mounted to the pad portion exposed by removing the thin film encapsulation layer.

Abstract: A display device includes a substrate including a first surface and a second surface, pixels and first lines disposed on the first surface of the substrate, a first protective layer disposed on the second surface of the substrate and overlapping the pixels and the first lines, via holes penetrating the substrate and the first protective layer and exposing an area of each of the first lines, second lines disposed on a surface of the first protective layer and electrically connected to the first lines through the via holes, respectively, and pads disposed on the surface of the first protective layer and electrically connected to the second lines, respectively. The first protective layer includes openings corresponding to the via holes and also includes a photoresist material.

Abstract: A display device includes a display layer including pixels each including at least one transistor, a connection wiring electrically connected to the at least one transistor and exposed to a lower surface of the display layer through a first contact hole in the display layer, a base member disposed under the display layer and including a first hole exposing the connection wiring exposed to the lower surface of the display layer, a first lower protective layer disposed on a lower surface of the base member and including a second hole overlapping the first hole, a pad portion disposed on a lower surface of the first lower protective layer, and a lead line disposed on the lower surface of the first lower protective layer and electrically connecting the pad portion and the connection wiring. A tiled display device includes multiple display devices.

Abstract: A display device includes a display layer comprising pixels, each of the pixels having at least one thin-film transistor, a connection line electrically connected to the at least one thin-film transistor, the connection line being exposed on a lower surface of the display layer through a first contact hole formed in the display layer, a barrier layer disposed on the lower surface of the display layer and including a second contact hole connected to the first contact hole, a lead line disposed on a lower surface of the barrier layer and electrically connected to the connection line through the second contact hole, a pad part disposed on the lower surface of the barrier layer and electrically connected to the lead line, and a lower film overlapping the lower surface of the barrier layer and the lead line.

Abstract: A tiled display includes a first display device comprising a first display area and a first pad area having grooves, and a second display device comprising a second display area and a second pad area overlapping the second display area, the second pad area having protrusions, wherein the protrusions are inserted into the grooves to connect the first pad area with the second pad area.

Abstract: A method of manufacturing an organic light-emitting display apparatus includes forming a pixel electrode and a pixel-defining layer on a substrate, the pixel-defining layer covering edges of the pixel electrode sequentially forming a lift-off layer and a photoresist on the pixel electrode and the pixel-defining layer patterning the lift-off layer and the photoresist to define an opening that exposes a top surface of the pixel electrode and a portion of the pixel-defining layer sequentially forming an intermediate layer and an opposite electrode in the opening and on the photoresist, the intermediate layer including an emission layer forming a passivation layer to cover an entirety of a top surface and end portions of the opposite electrode and removing the lift-off layer and the photoresist that remain outside the opening.

Abstract: A display device includes a substrate and a protection film disposed on a rear side of the substrate. The substrate includes a first portion including a display area and having a first width, and a second portion extending from the first portion and having a second width narrower than the first width. The protection film includes a cavity at a border portion of the first portion and the second portion of the substrate.

Abstract: A method for manufacturing a skin chip according to an exemplary embodiment of the present disclosure may include: a step of forming first and second PDMS layers disposed on both surfaces of a porous membrane and each having a microfluidic channel through which a culture medium is transferred to both surfaces of the porous membrane; a step of forming first and second MEA substrate layers disposed on the outer surfaces of the first and second PDMS layers, respectively, and having metal electrodes for measurement of TEER arranged at positions corresponding to the channels; and a step of forming first and second PMMA layers disposed on the outer surfaces of the first and second MEA substrate layers, respectively. In the method for manufacturing a skin chip according to in an exemplary embodiment of the present disclosure, the porous membrane may be made of a polycarbonate having pores of a predetermined size.

Abstract: According to an exemplary embodiment of the present disclosure, an organic light emitting element includes: a first electrode; a second electrode overlapping the first electrode; and an emission layer disposed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode includes a metal layer including a first material, an oxidation layer including a second material and disposed on two opposing surfaces of the metal layer, and a barrier layer disposed at a surface of the oxidation layer, and the second material has a smaller Gibbs free energy than that of the first material.

Abstract: Disclosed is an organic light emitting diode, including a cathode electrode and an anode electrode positioned above the cathode electrode. An emitting layer is positioned between the cathode electrode and the anode electrode. An electron transporting unit is positioned between the cathode electrode and the emitting layer. The electron transporting unit is configured to inject and transport electrons to the emitting layer. A buffer layer is disposed between the cathode electrode and the electron transporting unit. The buffer layer includes an organic layer and a metallic layer disposed on the organic layer.

Abstract: Disclosed is an organic light emitting diode, including a cathode electrode and an anode electrode positioned above the cathode electrode. An emitting layer is positioned between the cathode electrode and the anode electrode. An electron transporting unit is positioned between the cathode electrode and the emitting layer. The electron transporting unit is configured to inject and transport electrons to the emitting layer. A buffer layer is disposed between the cathode electrode and the electron transporting unit. The buffer layer includes an organic layer and a metallic layer disposed on the organic layer.