Patents by Inventor Se-Hun Goo

Se-Hun Goo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate supporting unit and single type substrate polishing apparatus using the same
    Patent number: 8113918
    Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: February 14, 2012
    Assignee: Semes Co., Ltd.
    Inventors: Gyo-Woog Koo, Chang-Ro Yoon, Jung-Gun Cho, Ki-Hoon Choi, Jung-Bong Choi, Duk-Hyun Son, Se-Hun Goo
  • SUBSTRATE SUPPORTING UNIT AND SINGLE TYPE SUBSTRATE POLISHING APPARATUS USING THE SAME
    Publication number: 20090325469
    Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.
    Type: Application
    Filed: November 19, 2008
    Publication date: December 31, 2009
    Applicant: SEMES CO., Ltd.
    Inventors: Gyo-Woog KOO, Chang-Ro Yoon, Jung-Gun Cho, Ki-Hoon Choi, Jung-Bong Choi, Duk-Hyun Son, Se-Hun Goo