Patents by Inventor Sehyeon Kim

Sehyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11859883
    Abstract: A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: January 2, 2024
    Assignees: LG ELECTRONICS INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yohan Lee, Bongjun Kim, Sehyeon Kim, Jaeyoung Kim, Minwoo Jeong, Hyungjin Sung, Jaebok Lee, Sunggoon Park
  • Publication number: 20230040390
    Abstract: A radiator according to one embodiment of the present invention comprises at least one group of heat dissipation layers that are applied to the surface of the radiator so as to be sequentially layered thereon, wherein the one group of heat dissipation layer comprises a first coating layer formed by applying either a first dispersion solution or a second dispersion solution, and a second coating layer formed by applying the dispersion solution differing from that on the first coating layer, the first dispersion solution comprises positively charged metal oxide nanoparticles, and the second dispersion solution comprises negatively charged carbon nanotubes (CNT-COOH). The heat dissipation layer is formed in a porous thin film structure so as to have thickness of several micrometers, and thus increases a heat dissipation area by ten times, thereby improving heat dissipation efficiency, and can be applied without being restricted by the size, volume, shape, arrangement and the like of a radiator.
    Type: Application
    Filed: January 7, 2021
    Publication date: February 9, 2023
    Inventors: Minwoo JEONG, Sehyeon KIM, Bongjun KIM, Wonjoon CHOI, Jaemin LEE
  • Publication number: 20220307743
    Abstract: A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 29, 2022
    Inventors: Yohan LEE, Bongjun KIM, Sehyeon KIM, Jaeyoung KIM, Minwoo JEONG, Hyungjin SUNG, Jaebok LEE, Sunggoon PARK
  • Patent number: 11399445
    Abstract: An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: July 26, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Minjae Park, SeHyeon Kim, BongJun Kim, MinWoo Jeong, Keunsun Lee
  • Patent number: 11365917
    Abstract: A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: June 21, 2022
    Assignees: LG ELECTRONICS INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yohan Lee, Bongjun Kim, Sehyeon Kim, Jaeyoung Kim, Minwoo Jeong, Hyungjin Sung, Jaebok Lee, Sunggoon Park
  • Patent number: 11221152
    Abstract: A dehumidifier is provided. The dehumidifier may include a case having an air intake opening and an air discharge opening, an evaporator arranged inside the case and having evaporating fins coupled to evaporating tubes, a condenser arranged inside the case spaced apart from the evaporator, a fan that flows air in a direction from the evaporator to the condenser, and a heat pipe assembly positioned in front of and behind the evaporator in the air flow direction spaced apart from the evaporator. The heat pipe assembly may include heat pipes and heat-conducting fins each having a heat pipe coupling hole formed therein to be coupled to the respective heat pipe. Heat pipes may include heat-absorbing pipe portions positioned in front of the evaporator, heat-dissipating pipe portions positioned between the evaporator and the condenser, and connecting pipe portions that connect the heat-absorbing pipe portion to the heat-dissipating pipe portion, respectively.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: January 11, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Minwoo Jeong, Bongjun Kim, Sehyeon Kim, Jaeyoung Kim, Yohan Lee
  • Publication number: 20210404672
    Abstract: A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.
    Type: Application
    Filed: May 15, 2018
    Publication date: December 30, 2021
    Inventors: Yohan LEE, Bongjun KIM, Sehyeon KIM, Jaeyoung KIM, Minwoo JEONG, Hyungjin SUNG, Jaebok LEE, Sunggoon PARK
  • Publication number: 20210076534
    Abstract: An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.
    Type: Application
    Filed: July 21, 2020
    Publication date: March 11, 2021
    Inventors: Minjae PARK, SeHyeon Kim, BongJun Kim, MinWoo Jeong, Keunsun Lee
  • Patent number: 10551127
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: February 4, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20190376701
    Abstract: The present embodiment comprises: a case having a suction body having an air intake opening formed therein and a discharge body having an air discharge opening formed therein; an evaporator which is arranged inside the case, and which has an evaporating fin coupled to an evaporating tube; a condenser arranged inside the case and spaced from the evaporator; a fan configured such that air is made to flow to the evaporator and then to the condenser; at least one heat pipe comprising heat pipe assemblies positioned in front of and behind the evaporator in the air flow direction, respectively, each heat pipe assembly comprising a heat-absorbing pipe portion preceding the evaporator in the air flow direction, a heat-radiating pipe portion positioned between the evaporator and the condenser in the air flow direction, and a connecting pipe portion that connects the heat-absorbing pipe portion and the heat-radiating pipe portion; and at least one heat-conducting fin having a heat pipe coupling hole formed therein to b
    Type: Application
    Filed: February 12, 2018
    Publication date: December 12, 2019
    Inventors: Minwoo JEONG, Bongjun KIM, Sehyeon KIM, Jaeyoung KIM, Yohan LEE
  • Publication number: 20190162432
    Abstract: A dehumidifier including a condenser configured to condense a refrigerant, an evaporator configured to evaporate the refrigerant, and a heat transfer module configured to absorb heat from air flowing into the evaporator and to transfer the heat to air discharged from the evaporator, wherein the heat transfer module includes a right module enclosing a right side of the evaporator and a left module enclosing a left side of the evaporator, whereby each of the right module and the left module includes a plurality of side heat pipes formed in a U shape to seal a fluid therein, the plurality of side heat pipes being vertically arranged; and a plurality of side cooling fins connected to the plurality of side heat pipes and horizontally arranged.
    Type: Application
    Filed: November 27, 2018
    Publication date: May 30, 2019
    Inventors: Minhwan KIM, Sehyeon Kim, Jaeyoung Kim, Yohan Lee
  • Patent number: 9557121
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: January 31, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20160377347
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes through which a refrigerant flows, a header including a tube connection part coupled to the plurality of refrigerant tubes and a refrigerant inflow part, a first pipe provided in the header to define a first flow space for the refrigerant, a second pipe surrounding the outside of the first pipe to define a second flow space for the refrigerant, and a communication hole defined in the first or second pipe to allow the refrigerant to pass therethrough.
    Type: Application
    Filed: September 8, 2016
    Publication date: December 29, 2016
    Inventors: Taegyun PARK, Naehyun PARK, Sehyeon KIM
  • Patent number: 9353997
    Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: May 31, 2016
    Assignee: LG ELECTRONICS INC.
    Inventors: Sehyeon Kim, Eungyul Lee
  • Publication number: 20150226495
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes through which a refrigerant flows, the plurality of refrigerant tube being disposed to be spaced apart from each other in one direction and a plurality of fins disposed between the plurality of refrigerant tubes. A distance between the fins disposed on a front end-side of the plurality of refrigerant tubes is greater than that between the fins disposed on a rear end-side of the plurality of refrigerant tubes.
    Type: Application
    Filed: January 28, 2015
    Publication date: August 13, 2015
    Inventors: Taegyun PARK, Seungmo JUNG, Sehyeon KIM
  • Patent number: 9033029
    Abstract: A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: May 19, 2015
    Assignee: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20150114030
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.
    Type: Application
    Filed: April 19, 2013
    Publication date: April 30, 2015
    Applicant: LG ELECTRONICS INC.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20140284035
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes through which a refrigerant flows, a header including a tube connection part coupled to the plurality of refrigerant tubes and a refrigerant inflow part, a first pipe provided in the header to define a first flow space for the refrigerant, a second pipe surrounding the outside of the first pipe to define a second flow space for the refrigerant, and a communication hole defined in the first or second pipe to allow the refrigerant to pass therethrough.
    Type: Application
    Filed: March 24, 2014
    Publication date: September 25, 2014
    Applicant: LG ELECTRONICS INC.
    Inventors: Taegyun PARK, Naehyun PARK, Sehyeon KIM
  • Publication number: 20130292104
    Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 7, 2013
    Applicant: LG Electronics Inc.
    Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
  • Publication number: 20130284414
    Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 31, 2013
    Applicant: LG Electronics Inc.
    Inventors: Sehyeon Kim, Eungyul Lee