Abstract: An embodiment of the present invention provides a stretchable substrate allowing various pitch control for a device thereon, and a method of controlling a device spacing using the same. Here, the stretchable substrate includes a cell and an electrode wiring. The cell is divided by cutting lines to form a plurality of cells. The electrode wiring is continuously provided on the plurality of cells not to cross the cutting line. A cell is connected to a neighboring cell by a connection portion in which a cutting line is not formed, and when a tensile force is applied, the cell is hinge-rotated around the connection portion, and the electrode wiring maintains a continuous state even when the cell is hinged.

Abstract: An embodiment of the present invention provides a stretchable substrate that may be significantly stretchable to be deformed but have a low rate of breakage. Here, the stretchable substrate includes a cell, a cut portion, and an extended cut line. A plurality of cells are formed in the substrate body, and a device is mounted thereon. The cut portion is formed in the substrate body to increase a distance between the cells when the substrate body is stretched. The extended cutting line is formed to extend from an end portion of the cut portion and bent inwardly of the cell so that corners of the cells are rounded.

Abstract: An embodiment of the present invention provides an element transferring method that may increase a yield of transferring an element, and an electronic panel manufacturing method using the same. The element transferring method includes: preparing a carrier film in which a first surface of an element on which a terminal is formed is adhered to an adhesive surface; providing a cover adhesive layer on the adhesive surface so that the second surface of the element that is opposite to the first surface and where the terminal is not formed is covered; transferring the element to the target substrate by adhering the cover adhesive layer to the target substrate while the second surface is facing the target substrate; and separating the carrier film from the element, wherein in transferring the element, the carrier film is pressed so that the surface of the cover adhesive layer is flat at the same height as the terminal.

Abstract: A touch screen panel includes a sensing electrode area, a pad area, and a peripheral wiring area. The sensing electrode area includes first sensing electrodes and second sensing electrodes on a touch substrate and spaced from each other. The peripheral wiring area connects the sensing electrode area to the pad area. Each of the first sensing electrodes includes a first sensing metal layer on the touch substrate, a sensing insulation layer on the first sensing metal layer, and a second sensing metal layer on the sensing insulation layer and having a mesh structure. The second sensing metal layer is thicker than the first sensing metal layer.

Abstract: A touch screen panel includes a sensing electrode area, a pad area, and a peripheral wiring area. The sensing electrode area includes first sensing electrodes and second sensing electrodes on a touch substrate and spaced from each other. The peripheral wiring area connects the sensing electrode area to the pad area. Each of the first sensing electrodes includes a first sensing metal layer on the touch substrate, a sensing insulation layer on the first sensing metal layer, and a second sensing metal layer on the sensing insulation layer and having a mesh structure. The second sensing metal layer is thicker than the first sensing metal layer.