Abstract: A radio frequency switch apparatus includes switching circuits connected between respective signal terminals and an antenna terminal. Each of the switching circuits includes a series switching circuit and a shunt switching circuit configured to switch a signal band on and off. An inductor circuit includes an inductor device connected between at least one shunt switching circuit of the switching circuits and a ground. The inductor device suppresses noise and passes the signal band by being resonant with a capacitance present upon the shunt switching circuit being turned off.

Abstract: A semiconductor package includes a device embedded portion including a first substrate having a first device embedded therein and a second substrate disposed on the first substrate, a device mounting portion comprising a second device disposed on the device embedded portion, and a sealing portion for sealing the second device, and a second module mounted on a surface of the device embedded portion that is opposite of a surface on which the device mounting portion is disposed.

Abstract: A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.

Abstract: A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.

Abstract: A radio frequency switch apparatus includes switching circuits connected between respective signal terminals and an antenna terminal. Each of the switching circuits includes a series switching circuit and a shunt switching circuit configured to switch a signal band on and off. An inductor circuit includes an inductor device connected between at least one shunt switching circuit of the switching circuits and a ground. The inductor device suppresses noise and passes the signal band by being resonant with a capacitance present upon the shunt switching circuit being turned off.

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

Abstract: A front end circuit includes a switch including two ports disposed at a primary side of the switch and ports disposed at a secondary side of the switch. The front end circuit also includes a filter unit forming return paths using at least a portion of the ports disposed on the secondary side of the switch. The filter unit includes a filter positioned on each of the return paths.

Abstract: A front end circuit includes a switch including two ports disposed at a primary side of the switch and ports disposed at a secondary side of the switch. The front end circuit also includes a filter unit forming return paths using at least a portion of the ports disposed on the secondary side of the switch. The filter unit includes a filter positioned on each of the return paths.

Abstract: A semiconductor package includes: a board; a sealing member disposed on the board; at least one chip member mounted on the board and embedded in the sealing member; and at least one inductor embedded in the sealing member and disposed over a chip member among the at least one chip member.

Abstract: A printed circuit board includes: insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

Abstract: There are provided a method for providing a relay network and a mobile router and a network relay system using the same. The method for providing the relay network is performed in the mobile router generating the relay network using a plurality of mobile terminals. The method for providing the relay network includes checking a remaining data usage amount for the plurality of respective mobile terminals using a first wireless communications network, checking a tethering priority using the remaining data usage amount and determining a first mobile terminal having the highest tethering priority, and configuring the relay network by providing wireless data provided from the remainder of mobile terminals to the first mobile terminal through a second wireless communications network.

Abstract: Disclosed herein is a heating plate of a heating device for a semiconductor manufacturing process, including: a metal matrix, which is composed of a Ni—Fe—Co alloy, and in which a heating element is buried; a first ceramic layer formed on one side of the metal matrix; and a second ceramic layer formed on the other side and circumference of the metal matrix. According to the heating plate for a semiconductor manufacturing process of the present invention, even when thermal shock caused by repetition of heating and cooling is applied to the metal matrix composed of a Ni—Fe—Co alloy, the heating plate can exhibit excellent thermal shock resistance because the consistency between the metal matrix and the ceramic layer made of AlN or the like is maintained, and can prevent the metal matrix from being damaged because the ceramic layer has excellent chemical resistance and wear resistance.

Abstract: There are provided a method for providing a relay network and a mobile router and a network relay system using the same. The method for providing the relay network is performed in the mobile router generating the relay network using a plurality of mobile terminals. The method for providing the relay network includes checking a remaining data usage amount for the plurality of respective mobile terminals using a first wireless communications network, checking a tethering priority using the remaining data usage amount and determining a first mobile terminal having the highest tethering priority, and configuring the relay network by providing wireless data provided from the remainder of mobile terminals to the first mobile terminal through a second wireless communications network.

Abstract: There is provided an apparatus for sharing a wireless LAN antenna, including: a switch connecting a signal input terminal to one of a first path, a second path and a third path; a first communications processing unit synthesizing a data signal received in a preset first communications scheme a data signal via the first path and separating a data signal to be transmitted to transmit a part of the data signal in the first communications scheme and the other part of the data signal to the second-path; a second communications processing unit transmitting a data signal via the third path in a preset second communications scheme during the receiving operation and transmitting the received data signal in the second communications scheme to the third path during the transmitting operation; a wireless LAN communications unit transmitting/receiving a wireless LAN signal to/from the first path or the first communications processing unit.

Abstract: A wireless local area network (WLAN) router may include: a controlling unit selecting a temporary relay terminal among good communications terminals and performing controlling to request that the selected temporary relay terminal perform a WLAN temporary relay, in the case in which support target terminals outside of a WLAN good communications area are present; a WLAN communications unit performing WLAN communications with communications-enabled terminals depending on the controlling of the controlling unit to collect information required for selecting the temporary relay terminal from the communications-enabled terminals and provide the collected information to the controlling unit; and a local area communications unit requesting that the temporal relay terminal perform the WLAN temporal relay of the support target terminals depending on the controlling of the controlling unit.

Abstract: A method of manufacturing a cold-rolled magnesium alloy sheet for improving formability, including, (a) preparing a composite sheet which is composed of a main sheet made of magnesium alloy and a restrainer made of steel and functioning to suppress transverse plastic deformation (plastic deformation in a transverse direction) of the main sheet during a rolling process, (b) performing a cold-rolling of the composite sheet, and (c) separating the cold-rolled magnesium alloy sheet from the cold-rolled composite sheet obtained from (b). The magnesium alloy sheets manufactured by the invention has improved formability at an ambient temperature, and thus can be usefully applied to extensive industrial fields such as automobiles and aircrafts.

Abstract: The subject of the invention is a heat treatment process by flame treatment of at least one thin film deposited on a glass substrate (1) running in the path of at least one flame treatment device comprising at least one burner (2), said treatment being able to increase the degree of crystallization of said at least one thin film and/or to increase the size of the crystallites in said at least one thin film, said process being characterized in that the maximum transient bending “b” is less than 150 mm and respects the following condition: b?0.

Abstract: An electroconductive layer (2) designed to be combined with a substrate having a glass function, said layer (2) being composed of a metal grid (9), characterized in that the metal grid (9) consists of a pure metal and in that it is coated with at least one electrochemical protection layer (10), especially a metal layer or a metal nitride layer.