Patents by Inventor Se Min Bang

Se Min Bang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240063357
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 22, 2024
    Inventor: Se Min BANG
  • Patent number: 11749792
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: September 5, 2023
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Se Min Bang
  • Publication number: 20220246808
    Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri CHOI, Hyuck Jun KIM, Se Min BANG, Do Choul WOO, Se Won TAE
  • Patent number: 11355685
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 7, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Publication number: 20220158064
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Application
    Filed: February 3, 2022
    Publication date: May 19, 2022
    Inventor: Se Min BANG
  • Patent number: 11335837
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: May 17, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Patent number: 11309469
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 19, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11251351
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 15, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Se Min Bang
  • Publication number: 20210050492
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri CHOI, Hyuck Jun KIM, Se Min BANG, Do Choul WOO, Se Won TAE
  • Patent number: 10825969
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 3, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Publication number: 20200220060
    Abstract: A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Se Min BANG
  • Patent number: 10615321
    Abstract: A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: April 7, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Publication number: 20200066950
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Application
    Filed: October 31, 2019
    Publication date: February 27, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Publication number: 20190393392
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 26, 2019
    Inventors: Seung Li CHOI, Se Min BANG, Se Won TAE
  • Publication number: 20190058095
    Abstract: A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.
    Type: Application
    Filed: May 8, 2018
    Publication date: February 21, 2019
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae