Abstract: Disclosed is a sound-absorbing material for an electric vehicle including a heat-sealed non-woven fabric, a dot-pattern adhesive layer disposed on the heat-sealed non-woven fabric, and a melt blown non-woven fabric disposed on the dot-pattern adhesive layer.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber in which a process with respect to a substrate is performed, a susceptor which is installed in the chamber and on which the substrate is placed, a plurality of lift pins passing through the susceptor to support the substrate, and a plurality of protection plugs protruding from a bottom surface of the susceptor to surround a portion of each of the lift pins protruding from the bottom surface of the susceptor.

Abstract: A substrate processing apparatus includes a support unit supporting a substrate, a rear nozzle unit installation unit including a sidewall surrounding the support unit and forming an internal space, a rear nozzle unit including a rear nozzle movably disposed outside of the sidewall to supply liquid toward a rear surface of the substrate and a rear nozzle driving unit connected to the rear nozzle through a partial sidewall portion of the sidewall in the internal space and driving the rear nozzle to move, and a liquid inflow preventing unit disposed on the partial sidewall portion of the sidewall and including an isolation space isolated from the internal space.

Abstract: An apparatus and a method of reducing the replacement cycle due to abrasion of chuck pins that support a lateral surface of a substrate are proposed. A substrate gripping apparatus for gripping the substrate in substrate processing equipment includes a chuck, a gear box configured to be movable with respect to the chuck, a rotation gear provided inside the gear box, chuck pins configured to be rotatable while being coupled to the rotation gear and to be brought into contact with a lateral surface of the substrate. According to the embodiment of the present disclosure, the substrate is configured such that the lateral surface thereof is supported by various positions of each of the chuck pins. Therefore, the life of the chuck pins can be improved and maintenance costs can be reduced.