Patents by Inventor Se-Rang IM

Se-Rang IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150179594
    Abstract: A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second photo resist on the first photo resist and forming a second open hole corresponding to shapes of a soldering pad, a circuit pattern layer and the bonding pad in the second photo resist; and forming a pattern plating layer up to a predetermined height in the first open hole and the second open hole.
    Type: Application
    Filed: March 19, 2014
    Publication date: June 25, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun-Oh HWANG, Myung-Sam KANG, Young-Kwan LEE, Seung-Yeop KOOK, Seung-Eun LEE, Se-Rang IM