Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.

Abstract: The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.

Abstract: Disclosed is a method of manufacturing a printed circuit board, including (A) forming a first circuit layer on a base substrate and forming a first insulating layer thereon, (B) forming trenches including dummy trenches and wiring trenches on the first insulating layer and plating the trenches, thus providing a trench circuit layer including a dummy circuit pattern and a wiring circuit pattern, (C) removing the dummy circuit pattern of the trench circuit layer, and (D) forming a second insulating layer on the trench circuit layer from which the dummy circuit pattern was removed. The method reduces deviation of plating thickness and thus realizes the design density of a trench circuit layer.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method for manufacturing a printed circuit board can include forming a circuit pattern over a seed layer that is formed over an insulation layer, pressing the circuit pattern such that the circuit pattern and the seed layer corresponding with the circuit pattern are buried in the insulation layer, and removing the exposed seed layer. This method can prevent undercuts caused by etching in the seeds positioned between the circuit pattern and the insulation layer, and can thereby prevent the circuit pattern from becoming detached. Also, the adhesion between the circuit pattern and the insulation layer can be increased, making it possible to implement a finer circuit pattern over the insulation layer.