Abstract: A display device includes a glass substrate including a first surface, a second surface opposite to the first surface, and a side surface between the first and second surfaces, an outermost structure disposed on the first surface and adjacent to an edge of the glass substrate, and a display area including a plurality of emission areas spaced apart from the edge on the first surface of the glass substrate. The side surface has a curved shape with the edge protruding to an outermost side of the glass substrate, the side surface includes a first side surface between the edge and the first surface, and a second side surface between the edge and the second surface and having a different curvature from the first side surface, and the glass substrate includes an edge area on the first surface, adjacent to the edge, and, in which processing traces are left.

Abstract: The invention relates to a wafer for use as a substrate for a semiconductor device, the wafer comprising a round zone formed along a circumference thereof; a flat zone wherein the circumference thereof is partially cut in a straight line; and a laser marking region functioning as a wafer bar-code which is formed in an upper portion of the round zone opposite to and apart from the flat zone. The wafer bar-code has holes having about 2 .mu.m depth and is formed by a soft marking process. A good fine pattern can be formed on the wafer with a follow-on patterning process by substantially cleaning photoresist materials remaining in holes of the laser marking region. Further, the occurrence of G-defects can be reduced, such defects being caused by photoresist particles remaining on the surface of the wafer.

Abstract: A semiconductor wafer cleaning apparatus having an edge rinse member adapted for rinsing edges of a semiconductor wafer and having a moving member adapted to permit horizontally movement of the edge rinse member, wherein the apparatus is adapted to minimize or prevent an upper surface of the wafer from being stained with pollutants during rinsing. The wafer cleaning apparatus minimizes or prevents rebounding of a rinse solution containing particles from the inside wall of a bowl during rinsing of the edges of a semiconductor wafer.