Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: An example electronic device includes a display, a communication circuit, a memory, and at least one processor configured to, based on a signal for requesting transmission of identification information including a call word for using first mode of an artificial intelligence assistant function of the electronic device being received, from another electronic device, through the communication circuit using first communication method, control the display to display a user interface for requesting user confirmation for transmission of the identification information; control the communication circuit to transmit the identification information to the another electronic device as a result of user confirmation through the user interface; and receive information for using a second communication method from the another electronic device.

Abstract: The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.

Abstract: The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.