Abstract: A shield is provided. The shield includes a shield frame surrounding an electronic component mounted on a printed circuit board and a shield cover partially coupled to the shield frame. The shield frame includes a column part mounted on the printed circuit board and a bending part bent from an upper end portion of the column part. An angle between both end portions of the bending part is smaller than about 90 degrees.

Abstract: An electronic device and a method of controlling the electronic device are provided. A memory and a processor are electrically connected with the memory. The processor controls at least one of a change in a specified operation power, a change in a specified operation clock rate, and an operation state of a diversity module of the electronic device when the electronic device enters an inactive period after an active period associated with transmitting data has ended.

Abstract: A method for managing power of an electronic device and the electronic device thereof are provided. An operation method of the electronic device includes detecting a remaining battery capacity, calculating and storing a reduced ratio per unit time of the remaining battery capacity and, based on the reduced ratio, predicting a remaining operating time of the battery.

Abstract: Disclosed is a system for controlling a power trunk in a trunk-equipped vehicle, including: a motor configured to transfer power to the trunk to drive the trunk; a velocity sensing unit configured to sense a velocity of the motor; a control unit configured to compute a current trunk position and an operational velocity based on information on the velocity of the motor sensed by the velocity sensing unit and control the motor based on the computed position and the operational velocity, wherein a predetermined target velocity and the operational velocity are compared, and a difference between the target velocity and the operational velocity is compensated using a proportional integral derivative (PID) control scheme. It is possible to constantly control an open/close velocity of a power trunk regardless of a change of external environments when a power trunk is opened or closed in a vehicle having a power trunk system.

Abstract: A method for controlling a temperature of a terminal and a terminal supporting the same are provided. A terminal supporting temperature control includes a temperature sensor for detecting a temperature of the terminal, and a controller for performing at least one of a first throttle procedure including driving the controller with a first preset driving frequency when the temperature of the terminal detected by the temperature sensor is a first preset temperature, and driving the controller with a second driving frequency higher than the first driving frequency when the temperature of the terminal is reduced to a second preset temperature lower than the first preset temperature, and a second throttle procedure including driving the controller with the first preset driving frequency for a first time, and driving the controller with the second driving frequency higher than the first driving frequency for a second time after the first time elapses.

Abstract: A method comprises providing power from a battery to an external device using a first circuit; and receiving power from a first power source to provide power to the battery using a second circuit while providing power to the external device.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: A method for controlling a temperature of a terminal and a terminal supporting the same are provided. A terminal supporting temperature control includes a temperature sensor for detecting a temperature of the terminal, and a controller for performing at least one of a first throttle procedure including driving the controller with a first preset driving frequency when the temperature of the terminal detected by the temperature sensor is a first preset temperature, and driving the controller with a second driving frequency higher than the first driving frequency when the temperature of the terminal is reduced to a second preset temperature lower than the first preset temperature, and a second throttle procedure including driving the controller with the first preset driving frequency for a first time, and driving the controller with the second driving frequency higher than the first driving frequency for a second time after the first time elapses.

Abstract: A method of manufacturing a Through Mold Via (TMV) package-on-package device while preventing a bad solder joint from occurring in the TMV package-on-package device is provided. The method includes coating exposed portions of a lower semiconductor package with an organic soldering preservative, and stacking a top semiconductor package on the lower semiconductor package and connecting lower solder balls of the top semiconductor package with the top solder balls of the lower semiconductor package. According to the method, a bad solder joint may be prevented from occurring when a top semiconductor package is bonded to a lower semiconductor package.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: An apparatus and method of improving power noise of a Ball Grid Array (BGA) package are provided. The method includes securing a space for a passive element mounting pad, on which a passive element can be mounted, adjacent to a power pad on a Printed Circuit Board (PCB) corresponding to a power pin of the BGA package, mounting the passive element on the passive element mounting pad, and mounting the BGA package at a position on the PCB, wherein the position on the PCB overlaps the passive element and further wherein the BGA package is mounted above the passive element.

Abstract: A connecting device and method for electronic machinery. The connecting device for electronic machinery includes a PCB provided with first contact points, a case provided with second contact points, on which electronic parts are mounted, and at least one connection member formed integrally with at least one of the PCB and the case such that the first and second contact points can be electrically connected. The connecting device for electronic machinery can electrically connect electronic parts having contact points easily without any additional part.

Abstract: Disclosed is a method for manufacturing an electronic device using LDS and an electronic manufacturing by the method, in which resin for LDS is adhered to an inner surface of an external case by double injection or insert injection so as to implement a circuit. The electronic device using LDS includes upper and lower external cases, wherein resin for LDS is adhered to an inner surface of the lower external case by double injection or insert injection. Components of the electronic device are mounted on the resin, and the upper and lower external case are assembled with each other.

Abstract: A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with

Abstract: A board assembly apparatus and a manufacturing method includes applying solder paste onto a first surface of a first board, arranging electronic components on the first surface of the first board on which the solder paste is applied, arranging a second board above the electronic components and the first surface of the first board, and curing the solder paste.

Abstract: A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with

Abstract: A method of surface-mounting a semiconductor chip on a PCB, for mounting a flip chip type semiconductor chip on the PCB mounted with electronic components, that includes forming a solder bump on a conductive contact area of each semiconductor chip on a back of a semiconductor wafer mounted with a plurality of semiconductor chips, injecting underfill material on the area of the semiconductor wafer formed with the solder bump, partially hardening the underfill material to have cohesive properties, severing the semiconductor wafer into a plurality of individual semiconductor chips, arranging the severed semiconductor chips having the hardened underfill material on the PCB, and heating the PCB with a predetermined temperature.

Abstract: A method of fabricating lead-free solder bumps, including providing a wafer having a protective layer with an open electrode pad; forming an UBM (under bump metallization) layer on the wafer; lithographing a photoresist on the UBM layer, excluding a portion of the UBM layer corresponding to the electrode pad; forming a copper layer on the portion of the UBM layer corresponding to the electrode pad; plating solder on the copper layer; removing the photoresist; and etching the UBM layer using the solder as a mask, and reflowing the solder and fabricating solder bumps.

Abstract: A method for fabricating chip size packages which uses a lamination process, thereby not only achieving an improvement in the reliability of final electronic products, a reduction in the manufacturing costs, and a mass production resulting in a high marketability, but also being applicable to the fabrication of packages for both memory and non-memory chips and enabling the final electronic products to have high electronic performance while making the package size of the final electronic products not greater than 1.2 times the semiconductor chip size.