Abstract: Electronic component (1; 20) has at least one stack (2; 21, 23) with at least two semiconductor chips (8, 9; 32, 33; 42, 43). Each semiconductor chip (8, 9; 32, 33; 42, 43) includes an active surface including integrated circuits (11; 35) and chip contact pads (10; 34) at least one being a ground cell (13; 37) and a passive surface. The electronic component (1; 20) further includes at least one intermediate spacer (14; 38; 44) with a thermally conductive and electrically conductive material. The intermediate spacer block (14; 38; 44) is positioned between the active surface of a semiconductor chip (9; 33; 43) and the passive surface of an adjacent semiconductor chip (8; 32; 42) in the stack (2; 21, 23). The intermediate spacer (14; 38; 44) and the ground cells (13; 37) of the semiconductor chips (9; 33; 43) are electrically connected and have a common ground.