Abstract: The present disclosure describes various embodiments of systems, apparatuses, and methods for implementing an array antenna having a combination of ferromagnetic and nonferromagnetic conductors in alternating multilayers. One such antenna device comprises an array of patch antennas on a substrate, wherein the patch antennas are formed of a combination of ferromagnetic and nonferromagnetic conductors in alternating multilayers; and a microstrip feeding line coupled to the array of patch antennas. Other systems, apparatuses, and methods are also presented.

Abstract: Various examples are provided for meander line (ML) slots, which can be used for mutual coupling reduction. In one example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate, the first and second patch antenna elements separated by a gap. The antenna array can include a meander line (ML) slot formed in a ground plane disposed on a second side of the substrate. A plurality of ML slots can be aligned with the gap between the first and second patch antenna elements. In another example, a method includes forming first and second antenna elements on a first side of a substrate and forming a ML slot in a ground plane disposed on a second side of the substrate aligned with a gap between the first and second antenna elements.

Abstract: Fin doping, and integrated circuit structures resulting therefrom, are described. In an example, an integrated circuit structure includes a semiconductor fin. A lower portion of the semiconductor fin includes a region having both N-type dopants and P-type dopants with a net excess of the P-type dopants of at least 2E18 atoms/cm3. A gate stack is over and conformal with an upper portion of the semiconductor fin. A first source or drain region is at a first side of the gate stack, and a second source or drain region is at a second side of the gate stack opposite the first side of the gate stack.

Abstract: Various examples are provided for meander line (ML) slots, which can be used for mutual coupling reduction. In one example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate, the first and second patch antenna elements separated by a gap. The antenna array can include a meander line (ML) slot formed in a ground plane disposed on a second side of the substrate. A plurality of ML slots can be aligned with the gap between the first and second patch antenna elements. In another example, a method includes forming first and second antenna elements on a first side of a substrate and forming a ML slot in a ground plane disposed on a second side of the substrate aligned with a gap between the first and second antenna elements.

Abstract: The present disclosure describes various embodiments of systems, apparatuses, and methods for implementing an array antenna having a combination of ferromagnetic and nonferromagnetic conductors in alternating multilayers. One such antenna device comprises an array of patch antennas on a substrate, wherein the patch antennas are formed of a combination of ferromagnetic and nonferromagnetic conductors in alternating multilayers; and a microstrip feeding line coupled to the array of patch antennas. Other systems, apparatuses, and methods are also presented.

Abstract: Various examples are provided that are related to fractal-based reactive impedance surfaces. These surfaces allow for miniaturization of antennas. In one example, a fractal rectangular reactive impedance surface (FR-RIS) includes a plurality of fractal rectangular (FR) patches having an outer edge defined by a fractal rectangular pattern that is repeated along each side of inner FR patches of the plurality of FR patches. The fractal rectangular pattern of a FR patch matches with the fractal rectangular pattern of an adjacent FR patch. An antenna can include a planar antenna disposed over the FR-RIS.

Abstract: Various examples are provided for point symmetric complementary meander line (PSC-ML) slots, which can be used for mutual coupling reduction. In one example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate, the first and second patch antenna elements separated by a gap. The antenna array can include point symmetric complementary meander line (PSC-ML) slots formed in a ground plane disposed on a second side of the substrate. The PSC-ML slots can include a pair of ML slots aligned with the gap between the first and second patch antenna elements. In another example, a method includes forming first and second antenna elements on a first side of a substrate and forming PSC-ML slots in a ground plane disposed on a second side of the substrate that are aligned with a gap between the first and second antenna elements.

Abstract: Various examples related to metaconductor based skins and transmission lines are provided. In one example, a flexible metaconductor skin includes a flexible substrate; at least one layer of non-ferromagnetic metal disposed on the flexible substrate; and a layer of ferromagnetic metal disposed on the at least one layer of non-ferromagnetic metal. The flexible metaconductor skin can be used as a multi-layer coplanar waveguide (CPW) transmission line.

Abstract: Various examples are provided for smart transportation and sensing systems. In one example, an apparatus for smart transportation sensing includes a reflector integrated in a contoured roadway unit configured to protect the reflector from damage by vehicles traveling along a transportation surface; and a radio frequency identification (RFID) tag integrated in the contoured roadway unit. In another example, a system for smart transportation includes a vehicle including a radio frequency identification (RFID) reader configured to interrogate RFID tags integrated in reflector units disposed along a transportation surface; and a processing system in communication with the RFID reader, the processing system configured to process data obtained from at least one of the RFID tags to determine vehicle location along the transportation surface.

Abstract: Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through-glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.

Abstract: Various examples are provided for point symmetric complementary meander line (PSC-ML) slots, which can be used for mutual coupling reduction. In one example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate, the first and second patch antenna elements separated by a gap. The antenna array can include point symmetric complementary meander line (PSC-ML) slots formed in a ground plane disposed on a second side of the substrate. The PSC-ML slots can include a pair of ML slots aligned with the gap between the first and second patch antenna elements. In another example, a method includes forming first and second antenna elements on a first side of a substrate and forming PSC-ML slots in a ground plane disposed on a second side of the substrate that are aligned with a gap between the first and second antenna elements.

Abstract: Various examples related to metaconductor based skins and transmission lines are provided. In one example, a flexible metaconductor skin includes a flexible substrate; at least one layer of non-ferromagnetic metal disposed on the flexible substrate; and a layer of ferromagnetic metal disposed on the at least one layer of non-ferromagnetic metal. The flexible metaconductor skin can be used as a multi-layer coplanar waveguide (CPW) transmission line.

Abstract: Various examples are provided that are related to fractal-based reactive impedance surfaces. These surfaces allow for miniaturization of antennas. In one example, a fractal rectangular reactive impedance surface (FR-RIS) includes a plurality of fractal rectangular (FR) patches having an outer edge defined by a fractal rectangular pattern that is repeated along each side of inner FR patches of the plurality of FR patches. The fractal rectangular pattern of a FR patch matches with the fractal rectangular pattern of an adjacent FR patch. An antenna can include a planar antenna disposed over the FR-RIS.

Abstract: Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through-glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.

Abstract: Various examples are provided for smart transportation and sensing systems. In one example, an apparatus for smart transportation sensing includes a reflector integrated in a contoured roadway unit configured to protect the reflector from damage by vehicles traveling along a transportation surface; and a radio frequency identification (RFID) tag integrated in the contoured roadway unit. In another example, a system for smart transportation includes a vehicle including a radio frequency identification (RFID) reader configured to interrogate RFID tags integrated in reflector units disposed along a transportation surface; and a processing system in communication with the RFID reader, the processing system configured to process data obtained from at least one of the RFID tags to determine vehicle location along the transportation surface.