Patents by Inventor Seamus A. Wedge

Seamus A. Wedge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer pouch with heat-shrinkable layer
    Patent number: 10759578
    Abstract: A multilayer pouch with heat-shrinkable layer is described. The pouch comprises a first wall; a second wall; a perimeter comprising a first edge and a second edge opposing the first edge; and a product space positioned between the first wall, the second wall, and the perimeter. The pouch is configured to fully enclose the product space. The first wall comprises a first wall first layer having a machine direction shrinkage value of greater than 5% shrink at 90° C., a first wall second layer having a machine direction Gurley stiffness force of at least 800 mgf and a machine direction shrinkage value at 90° C. of less than the machine direction shrinkage value of the first wall first layer at 90° C., a first wall pattern connection, and a first wall air inlet. The first wall first layer is interior the first wall second layer. Various embodiments of the pouch are also described.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: September 1, 2020
    Assignee: Bemis Company, Inc.
    Inventors: Peter M. Chen, Xiangke Shi, Jay D. Hodson, Seamus A. Wedge, Curtis R. Barr
  • MULTILAYER POUCH WITH HEAT-SHRINKABLE LAYER
    Publication number: 20190352069
    Abstract: A multilayer pouch with heat-shrinkable layer is described. The pouch comprises a first wall; a second wall; a perimeter comprising a first edge and a second edge opposing the first edge; and a product space positioned between the first wall, the second wall, and the perimeter. The pouch is configured to fully enclose the product space. The first wall comprises a first wall first layer having a machine direction shrinkage value of greater than 5% shrink at 90° C., a first wall second layer having a machine direction Gurley stiffness force of at least 800 mgf and a machine direction shrinkage value at 90° C. of less than the machine direction shrinkage value of the first wall first layer at 90° C., a first wall pattern connection, and a first wall air inlet. The first wall first layer is interior the first wall second layer. Various embodiments of the pouch are also described.
    Type: Application
    Filed: February 24, 2016
    Publication date: November 21, 2019
    Applicant: Bemis Company, Inc.
    Inventors: Peter M. Chen, Xiangke Shi, Jay D. Hodson, Seamus A. Wedge, Curtis R. Barr