Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.

Abstract: There are provided systems and methods for conducting secure wireless financial transactions using portable electronic devices. For example, a method of conducting a wireless transaction is provided that includes taking a picture of a first QR code displayed on a transaction terminal using a camera of a portable electronic device. The method also includes sending data from the portable electronic device to the transaction terminal to conduct the financial transaction with the transaction terminal using a near field communication channel or another wireless communication channel, or both. This data is derived from the first QR code to enable the transaction terminal to verify that the portable electronic device is physically located near the transaction terminal.

Abstract: A haptic feedback device configured to provide tactile or haptic feedback for an electronic device. The haptic device includes a platform operably secured to the electronic device to allow rotation about a center axis. An activating member is operably associated with the platform and configured to selectively cause the platform to rotate in a first direction. Also, the haptic feedback device includes a restoring member operably associated with the platform and configured to selectively return the platform to a first position after it has rotated for at least one of a select period of time or a select distance.

Abstract: A portable device includes: an enclosure, one or more processors for executing one or more programs; one or more actuators in or on the enclosure for generating mechanical vibrations; one or more sensors in or on the enclosure for detecting mechanical vibrations; and memory storing one or more programs for execution by the one or more processors. The device analyzes one or more signals produced by the one or more sensors with respect to mechanical vibrations to determine a holding state of the portable device, and conditionally modifies operation of at least one application executed by the one or more processors in accordance with the determined holding state.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: There is provided systems and methods for to conducting wireless transactions using portable electronic devices. Specifically, for example, a method of conducting a wireless transaction is provided that includes initiating a wireless transaction using a short range wireless communication system of a portable electronic device. The method also includes obtaining security information via at least one secondary system of the portable electronic device and utilizing the security information obtained via the at least one secondary system to authenticate the portable electronic device for the wireless transaction.