Patents by Inventor Sean A. Moran
Sean A. Moran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090148594Abstract: An interconnection element can be formed by plating a metal layer within holes in an essentially non-metallic layer of a mandrel, wherein posts can be plated onto a metal layer exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer to the conductive posts. At least a portion of the mandrel can then be removed from at least ends of the holes. In this way, the tips of the conductive posts can become raised above a major surface of the interconnection element such that at least the tips of the posts project beyond the major surface.Type: ApplicationFiled: August 15, 2008Publication date: June 11, 2009Applicant: Tessera, Inc.Inventors: Sean Moran, Jinsu Kwon, Kimitaka Endo
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Publication number: 20090145645Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.Type: ApplicationFiled: August 15, 2008Publication date: June 11, 2009Applicant: Tessera, Inc.Inventors: Jinsu Kwon, Kimitaka Endo, Sean Moran
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Publication number: 20090071707Abstract: A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.Type: ApplicationFiled: August 13, 2008Publication date: March 19, 2009Applicant: Tessera, Inc.Inventors: Kimitaka Endo, Philip Damberg, Craig S. Mitchell, Sean Moran, Christopher Wade, Belgacem Haba, John Riley
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Publication number: 20090045524Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.Type: ApplicationFiled: August 16, 2007Publication date: February 19, 2009Applicant: Tessera, Inc.Inventors: IIyas Mohammed, Belgacem Haba, Sean Moran, Wei-Shun Wang, Ellis Chau, Christopher Wade
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Patent number: 7349584Abstract: A method for correcting distortions in multi-focus image stacks comprising the steps: acquiring a plurality of N colour images with an optical system; wherein each color image encompasses a plurality of pixels; converting each of two successive colour images of the N images into monochrome images; scaling each of the monochrome images to a conveniently M by M image; calculating a geometric transformation and a radiometric transformation of the two successive images, wherein the geometric transformation and the radiometric transformation is determined by a set of coefficients, which are determined by least square matching, and using the determined set of coefficients from each of two successive images, to correct each image sequentially and thereby constructing the multi-focus image by applying the determined parameter set to each of the successive images.Type: GrantFiled: November 10, 2004Date of Patent: March 25, 2008Assignee: Leica Micrsystems CMS GmbHInventors: Jin Chen, Sean Moran, Gregory P. Davidson
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Publication number: 20080006613Abstract: A short resistant welder that includes, in some embodiments, a short circuit sensor configured to transmit a first signal indicative of a short circuit between a workpiece and a stud, and a stud welding controller communicatively coupled to the short circuit sensor. In certain embodiments, the stud welding controller is configured to transmit an increase-current control signal to a power supply in response to the first signal.Type: ApplicationFiled: July 10, 2006Publication date: January 10, 2008Inventors: Mark Ulrich, Sean Moran, Kenneth C. Altekruse, Ben Newcomb
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Publication number: 20070287133Abstract: A computer based simulation system for virtual training for vehicle crews is disclosed. The Vehicle Crew Training System (VCTS) simulates crew positions for different military ground and air vehicles. Two or more crewman modules are networked together to support a partial or full vehicle crew. The crewman modules are self-contained devices that are modular in hardware and software design, easily reconfigurable, and require minimal facility space, allowing use in restricted environments such as trailers. The VCTS is modular at the crew position level; crewman modules are added or deleted as required to meet a particular training need.Type: ApplicationFiled: May 24, 2006Publication date: December 13, 2007Inventors: Kevin Schubert, Sean Moran, Greg Wieboldt, Donnie Klein, Mark Haack, Sharon Lay, Chris Howard, Michael Dineen, Jerry R. Hubbard, William Araki
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Publication number: 20070262058Abstract: A welding system and method having power controller with workpiece sensor. In some embodiments, the welding system includes a stud welding power supply having a welding power output, a stud welding power controller, and a workpiece sensor. The stud welding power controller may be communicatively coupled to the stud welding power supply and the workpiece sensor. In certain embodiments, the stud welding power controller is responsive to a signal from the workpiece sensor indicative of a position of a stud in general proximity or engagement with a workpiece.Type: ApplicationFiled: May 15, 2006Publication date: November 15, 2007Inventors: Mark Ulrich, Sean Moran, Paul Leitermann
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Publication number: 20060183083Abstract: A computer based simulation system for virtual training for vehicle crews is disclosed. The vehicle crew training system (VCTS) simulates crew positions for different military vehicles. Two or more crewman modules are networked together to support a partial or full vehicle crew. The crewman modules are self-contained devices that are modular in hardware and software design, easily reconfigurable, and that require minimal facility space, allowing use in restricted environments such as trailers. The VCTS is modular at the crew position level; crewman modules are added or deleted as required to meet a particular training need. One of the crewman modules can be a gunner module, which provides an unrestricted view of the simulated environment to the gunner by means of a display and a simulated vehicle-mounted weapon.Type: ApplicationFiled: February 11, 2005Publication date: August 17, 2006Inventors: Sean Moran, Donnie Klein, Mark Haack, Sharon Lay, Christopher Howard, Michael Dineen, Jerry Hubbard, William Araki
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Publication number: 20060086696Abstract: A welding apparatus is presented that includes a post-firing detection system and control connected to communicate with the post-firing detection system such that a stud welding gun is prevented from activation if a recently fired welding stud remains connected to the stud welding gun.Type: ApplicationFiled: October 27, 2004Publication date: April 27, 2006Inventors: Mark Ulrich, Sean Moran, Warren Wran
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Publication number: 20060015058Abstract: The invention according to an exemplary embodiment relates to a method for transporting a substance across a biological membrane comprising the steps of applying a delipidation agent to a portion of the biological membrane, applying a hydration agent to the portion of the biological membrane, sonicating the portion of the biological membrane, and transporting the substance across the biological membrane. The step of applying the delipidation agent may be carried out prior to or simultaneously with the step of applying the hydration agent. The hydration agent may be applied before, during, or after the sonication step. The methods according to exemplary embodiments of the invention can provide improved transdermal transport in applications such as continuous analyte extraction and analysis and transdermal delivery of drugs and vaccines.Type: ApplicationFiled: February 25, 2005Publication date: January 19, 2006Inventors: Scott Kellogg, Shikha Barman, Lauren Roode, Hannah Farnham, Sean Moran, Samir Mitragotri, Joseph Kost, Nicholas Warner
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Publication number: 20050111932Abstract: A welding stud apparatus and method of manufacturing a welding stud are disclosed. The welding stud has a weld end constructed to be welded to a workpiece that has at least one recess formed therein. The recess decreases an effective arc area of the weld end to localize a current therethrough and increase the efficiency with which the welding stud can be welded to a workpiece.Type: ApplicationFiled: November 26, 2003Publication date: May 26, 2005Inventors: Bruce Albrecht, Sean Moran, Sundaram Nagarajan, Mark Ulrich
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Publication number: 20050100245Abstract: A method for correcting distortions in multi-focus image stacks comprising the steps: acquiring a plurality of N colour images with an optical system; wherein each color image encompasses a plurality of pixels; converting each of two successive colour images of the N images into monochrome images; scaling each of the monochrome images to a conveniently M by M image; calculating a geometric transformation and a radiometric transformation of the two successive images, wherein the geometric transformation and the radiometric transformation is determined by a set of coefficients, which are determined by least square matching, and using the determined set of coefficients from each of two successive images, to correct each image sequentially and thereby constructing the multi-focus image by applying the determined parameter set to each of the successive images.Type: ApplicationFiled: November 10, 2004Publication date: May 12, 2005Applicant: Leica Microsystems Cambridge Ltd.Inventors: Jin Chen, Sean Moran, Gregory Davidson
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Patent number: 6345097Abstract: A portable phone has a cavity at one end in which a hinge pin is rotatably mounted, with opposite ends of the hinge pin releasably secured to a flip panel rotatable between a closed position extending over part of one face of the phone, and an open position. The hinge pin includes a cam formation, and a biasing spring secured in the cavity has a bearing portion acting against the cam portion to releasably retain the flip panel in its open and closed positions. A cam retainer is mounted in the cavity to extend over the hinge pin and resist bending of the hinge pin out of a straight, axial orientation.Type: GrantFiled: December 7, 1998Date of Patent: February 5, 2002Assignee: QUALCOMM IncorporatedInventors: Thomas J. Chintala, Jose F. Olivas, Paul J. Smith, Sean Moran, James Beckwith
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Patent number: 6149443Abstract: A ground connector and standoff apparatus or spring member for mounting between two circuit boards is of conductive material and has opposing substantially flat, parallel first and second legs and a spring link connecting the legs. In an uncompressed condition of the spring member, the legs are spaced apart a predetermined distance greater than the spacing between the two circuit boards when connected together. The first leg is connected to one of the circuit boards and the second leg bears against an opposing portion of the other circuit board to provide a ground connection when the boards are connected together, compressing the spring member. A limiter or spacer on the spring member limits compression beyond a predetermined point at which the height of the spring member is equal to a predetermined standoff between the boards.Type: GrantFiled: September 26, 1997Date of Patent: November 21, 2000Assignee: Qualcomm IncorporatedInventor: Sean A. Moran
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Patent number: 5984697Abstract: A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.Type: GrantFiled: December 3, 1997Date of Patent: November 16, 1999Assignees: QUALCOMM Incorporated, Sony Electronics Inc.Inventors: Sean A. Moran, Roger W. Berg
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Patent number: 5917708Abstract: An EMI shielding apparatus has an outer peripheral wall extending around a combined area of predetermined shape and dimensions for enclosing at least two adjacent areas on a printed wiring board to be shielded from one another. A single transverse wall extends between opposing portions of the peripheral wall to divide the combined area into the two adjacent sub-areas to be shielded from one another. The single transverse wall is of single wall thickness, reducing the EMI shield footprint. The peripheral wall and transverse wall may be formed integrally as one frame, or from two or more adjacent sub-frames.Type: GrantFiled: March 24, 1997Date of Patent: June 29, 1999Assignee: Qualcomm IncorporatedInventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala
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Patent number: 5844784Abstract: A combined EMI shield and brace assembly has at least two frames for placing side-by-side on a printed wiring board to surround predetermined adjacent areas on the board containing components to be shielded from one another, and a brace member securing the two frames together during reflow. Each frame has a peripheral side wall forming an enclosed area of predetermined shape and dimensions and a portion of the side wall of one frame is placed against a portion of the side wall of the other frame so that the two frames together form an enlarged enclosed area divided into two sub-areas by the adjacent side wall portions extending across the enlarged area. The brace member extends over the frames and is secured to their side walls, and may secure two or more frames together.Type: GrantFiled: March 24, 1997Date of Patent: December 1, 1998Assignee: Qualcomm IncorporatedInventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala