Patents by Inventor Sean Archer

Sean Archer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9918408
    Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: March 13, 2018
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
  • Patent number: 9913402
    Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: March 6, 2018
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Steve Shafer, Sean Archer, David Roe, Lyle R. Tufty
  • Publication number: 20160360649
    Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
    Type: Application
    Filed: August 18, 2016
    Publication date: December 8, 2016
    Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
  • Publication number: 20160324033
    Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
    Type: Application
    Filed: July 13, 2016
    Publication date: November 3, 2016
    Inventors: Steve SHAFER, Sean ARCHER, David ROE, Lyle R. TUFTY
  • Patent number: 9451726
    Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: September 20, 2016
    Assignee: LiquidCool Solutions, Inc.
    Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
  • Patent number: 9426927
    Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: August 23, 2016
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Steve Shafer, Sean Archer, David Alan Roe, Lyle R. Tufty
  • Publication number: 20150146368
    Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 28, 2015
    Inventors: Steve SHAFER, Sean ARCHER, David Alan ROE, Lyle R. TUFTY
  • Publication number: 20140085821
    Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 27, 2014
    Applicant: LiquidCool Solutions, Inc.
    Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty