Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.

Abstract: The present disclosure is directed to an authentication system, tools, and methods for authentication including a first inspection tool that generates first images for a first inspection of a device, and a first processor for processing the first images using a hashing algorithm, for which the first inspection tool and the first processor are sited at a first location, and a second inspection tool that generates second images for a second inspection of the device, and a second processor for processing the second images using the hashing algorithm, for which the second inspection tool and the second processor are sited at a second location. The second processor compares the first and second sets of hash values to authenticate the device as being authentic and untampered.