Abstract: A patient-specific bone implant has a porous body with a core material covered with tantalum. It is made with unique outer dimensions selected to match a specific patient.

Abstract: A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.

Abstract: A dental prosthetic device has a body with a soft tissue engagement region formed of porous metal and that defines pores for the ingrowth of soft tissue into the pores. In one form, the porous metal includes tantalum. The porous metal may be partially filled with a resorbable material. The body may have a coronal end portion with an esthetic material.

Abstract: A dental implant has a body with a porous metal portion for engaging bone. The porous metal portion has an outer coronal to apical height and an outer diameter. Both the height and diameter are about 4 mm to about 6 mm. This permits the implant to be placed on a jaw with a reduced bone volume.

Abstract: A force or pressure transducer is includes a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on both the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and another portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured through associated circuitry.

Abstract: A medication infusion system may include a controller and a reservoir module including a reservoir containing medication to be delivered to an internal wound site via the controller. The controller may have a peristaltic pump driven by a motor to urge medication to flow toward the internal wound site, through a conduit. A blockage sensor disables the motor and provides an alarm if the tube is blocked. The blockage sensor detects distention of a preferentially distendable portion of the tube, which may be routed about a constraining member. When blockage occurs, the tube distends preferentially along a direction generally parallel to the radius about which the tube bends. The blockage sensor may include a variety of switching elements, such as a pushbutton switch, a metal ring encircling the tube to make contact between conductors, and/or a metal bridge bendable to make contact between conductors.

Abstract: A medication infusion system may include a controller and a reservoir module including a reservoir containing medication to be delivered to an internal wound site via the controller. The controller may have a peristaltic pump driven by a motor to urge medication to flow toward the internal wound site, through a conduit. When the conduit is not tensioned via engagement with the pump, a valve blocks fluid flow to prevent unrestricted flow of medication. The valve may have a tapered plunger separated from an annular valve seat by a portion of the conduit that elongates under tension to enable withdrawal of the plunger from the valve seat. Alternatively, the valve may have features such as a spherical plunger between two annular valve seats, a rigid tubular member biased with respect to the conduit, or an opening in the conduit that moves axially or radially to enable fluid flow.

Abstract: A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.

Abstract: A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.

Abstract: A tissue expansion device, the device comprising: (a) an expandable compartment adapted for implanting in a body of a subject; and (b) a gas source adapted for implanting in a body of a subject and operably connected to said expandable compartment for inflation thereof by transfer of a gas thereto.

Abstract: An orthopedic walker has a rigid external shell, a pliant internal boot positioned in the external shell, and a deformable insert positioned within the internal boot. The internal boot is sized to enclose a lower extremity of a user. The deformable insert has a heel segment including a fully-encircled heel opening. The deformable insert freely rests within the internal boot and is sized and positioned to receive the heel of the lower extremity within the heel opening. However, the deformable insert is sufficiently undersized to maintain a continuous exposed surface extending between a top surface of the foot and a front surface of the ankle.

Abstract: A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.

Abstract: A sculpted groundplane is provided so that monolithic dielectric structures are effectively shielded from their immediate surroundings through the implementation of transversely elongated “vias” which form continuous walls that effectively enclose the circuit elements. Further, these walls incorporate a ground plane within this same substrate, which allows for the realization of such structures on a single substrate for microstrip devices, and for realization of stripline structures utilizing only two substrates.

Abstract: A sculpted groundplane is provided so that monolithic dielectric structures are effectively shielded from their immediate surroundings through the implementation of transversely elongated “vias” which form continuous walls that effectively enclose the circuit elements. Further, these walls incorporate a ground plane within this same substrate, which allows for the realization of such structures on a single substrate for microstrip devices, and for realization of stripline structures utilizing only two substrates.

Abstract: A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.

Abstract: A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.

Abstract: A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.